Patent Assignment Details
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| Reel/Frame: | 035217/0338 | |
| Pages: | 4 |
| | Recorded: | 03/20/2015 | | |
| Attorney Dkt #: | 086206-0029 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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14396356
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Filing Dt:
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10/22/2014
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Publication #:
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Pub Dt:
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03/19/2015
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Title:
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HIGH-DENSITY MOLDING DEVICE AND HIGH-DENSITY MOLDING METHOD FOR MIXED POWDER
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Assignee
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| 2-10, OHYAMA-CHO, MIDORI-KU, SAGAMIHARA-SHI |
| KANAGAWA, JAPAN 252-5181 |
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Correspondence name and address
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MCDERMOTT WILL & EMERY LLP
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THE MCDERMOTT BUILDING
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500 NORTH CAPITOL STREET, N.W.
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WASHINGTON, DC 20001
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