Patent Assignment Details
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| Reel/Frame: | 035301/0300 | |
| Pages: | 10 |
| | Recorded: | 03/31/2015 | | |
| Attorney Dkt #: | XRPS920110036US2 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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04/17/2018
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Application #:
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14519981
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Filing Dt:
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10/21/2014
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Publication #:
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Pub Dt:
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02/05/2015
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Title:
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OVERMOLDED DUAL IN-LINE MEMORY MODULE COOLING STRUCTURE
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Assignee
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| 151, LORONG CHUAN |
| #02-01, NEW TECH PARK |
| SINGAPORE, SINGAPORE 556741 |
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Correspondence name and address
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LENOVO-KLS C/O KENNEDY LENART SPRAGGINS
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8601 RANCH ROAD 2222
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1-225
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AUSTIN, TX 78730
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