Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 035410/0118 | |
| Pages: | 13 |
| | Recorded: | 04/10/2015 | | |
| Attorney Dkt #: | T&A-GEN, H-1018 SERIES |
| Conveyance: | MERGER (SEE DOCUMENT FOR DETAILS). |
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Total properties:
4
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Patent #:
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Issue Dt:
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07/22/2003
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Application #:
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09987532
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Filing Dt:
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11/15/2001
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Publication #:
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Pub Dt:
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06/20/2002
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Title:
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METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE USING REINFORCING PATTERNS FOR ENSURING MECHANICAL STRENGTH DURING MANUFACTURE
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Patent #:
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Issue Dt:
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04/20/2004
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Application #:
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10453606
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Filing Dt:
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06/04/2003
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Publication #:
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Pub Dt:
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11/06/2003
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Title:
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METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE USING A MOLD
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Patent #:
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Issue Dt:
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03/29/2005
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Application #:
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10784276
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Filing Dt:
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02/24/2004
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Publication #:
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Pub Dt:
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08/26/2004
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Title:
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METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND A SEMICONDUCTOR DEVICE
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Patent #:
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Issue Dt:
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03/21/2006
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Application #:
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11047660
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Filing Dt:
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02/02/2005
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Publication #:
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Pub Dt:
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06/16/2005
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Title:
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METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND A SEMICONDUCTOR DEVICE
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Assignee
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| 39, 1007, IZUMISAWA |
| CHITOSE-SHI, HOKKAI-DO, JAPAN |
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Correspondence name and address
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MATTINGLY & MALUR, PC
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1800 DIAGONAL ROAD
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SUITE 370
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ALEXANDRIA, VA 22314
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