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Patent #:
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NONE
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Issue Dt:
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Application #:
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11882149
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Filing Dt:
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07/31/2007
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Publication #:
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Pub Dt:
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02/05/2009
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Title:
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Adhesive bleed prevention method and product produced from same
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Patent #:
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Issue Dt:
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02/12/2008
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Application #:
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11882625
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Filing Dt:
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08/03/2007
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Publication #:
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Pub Dt:
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11/22/2007
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Title:
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APPARATUS FOR MAKING CIRCUITIZED SUBSTRATES IN A CONTINUOUS MANNER
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Patent #:
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Issue Dt:
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09/15/2009
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Application #:
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11889668
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Filing Dt:
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08/15/2007
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Publication #:
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Pub Dt:
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12/13/2007
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Title:
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METHOD OF MAKING CIRCUITIZED SUBSTRATE WITH IMPROVED IMPEDANCE CONTROL CIRCUITRY, ELECTRICAL ASSEMBLY AND INFORMATION HANDLING SYSTEM
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Patent #:
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Issue Dt:
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05/21/2013
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Application #:
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11896786
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Filing Dt:
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09/06/2007
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Publication #:
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Pub Dt:
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01/03/2008
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Title:
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Circuitized substrate with dielectric layer having dielectric composition not including continuous or semi-continuous fibers
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Patent #:
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Issue Dt:
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03/31/2009
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Application #:
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11902976
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Filing Dt:
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09/27/2007
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Publication #:
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Pub Dt:
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01/24/2008
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Title:
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METHOD OF MAKING AN INTERPOSER
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Patent #:
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Issue Dt:
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11/02/2010
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Application #:
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11905188
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Filing Dt:
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09/28/2007
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Publication #:
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Pub Dt:
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01/31/2008
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Title:
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METHOD OF MAKING MULTILAYERED CIRCUITIZED SUBSTRATE ASSEMBLY
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Patent #:
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Issue Dt:
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05/11/2010
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Application #:
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11907004
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Filing Dt:
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10/09/2007
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Publication #:
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Pub Dt:
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04/09/2009
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Title:
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METHOD OF MAKING CIRCUITIZED SUBSTRATE WITH INTERNAL OPTICAL PATHWAY USING PHOTOLITHOGRAPHY
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Patent #:
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Issue Dt:
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06/02/2009
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Application #:
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11907006
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Filing Dt:
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10/09/2007
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Publication #:
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Pub Dt:
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04/09/2009
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Title:
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METHOD OF MAKING CIRCUITIZED SUBSTRATE WITH INTERNAL OPTICAL PATHWAY
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Patent #:
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Issue Dt:
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06/15/2010
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Application #:
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11976468
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Filing Dt:
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10/25/2007
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Publication #:
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Pub Dt:
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04/30/2009
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Title:
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CIRCUITIZED SUBSTRATE WITH INTERNAL COOLING STRUCTURE AND ELECTRICAL ASSEMBLY UTILIZING SAME
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11976629
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Filing Dt:
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10/26/2007
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Publication #:
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Pub Dt:
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03/06/2008
| | | | |
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Title:
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Circuitized substrate with increased roughness conductive layer as part thereof
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Patent #:
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Issue Dt:
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11/24/2009
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Application #:
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12003299
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Filing Dt:
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12/21/2007
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Publication #:
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Pub Dt:
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05/01/2008
| | | | |
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Title:
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METHOD OF MAKING MULTI-CHIP ELECTRONIC PACKAGE WITH REDUCED LINE SKEW
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Patent #:
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NONE
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Issue Dt:
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Application #:
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12007178
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Filing Dt:
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01/08/2008
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Publication #:
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Pub Dt:
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05/08/2008
| | | | |
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Title:
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Circuitized substrate with sintered paste connections and multilayered substrate assembly having said substrate as part thereof
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Patent #:
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NONE
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Issue Dt:
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Application #:
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12007704
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Filing Dt:
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01/15/2008
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Publication #:
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Pub Dt:
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07/16/2009
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Title:
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Method of making circuitized assembly including a plurality of circuitized substrates
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Patent #:
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Issue Dt:
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08/14/2012
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Application #:
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12007820
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Filing Dt:
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01/16/2008
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Publication #:
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Pub Dt:
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07/16/2009
| | | | |
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Title:
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METHOD OF MAKING CIRCUITIZED SUBSTRATES HAVING FILM RESISTORS AS PART THEREOF
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Patent #:
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Issue Dt:
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02/17/2009
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Application #:
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12010004
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Filing Dt:
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01/18/2008
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Publication #:
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Pub Dt:
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05/22/2008
| | | | |
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Title:
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INFORMATION HANDLING SYSTEM UTILIZING CIRCUITIZED SUBSTRATE WITH SPLIT CONDUCTIVE LAYER
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Patent #:
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Issue Dt:
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01/25/2011
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Application #:
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12010335
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Filing Dt:
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01/24/2008
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Publication #:
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Pub Dt:
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06/19/2008
| | | | |
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Title:
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HIGH SPEED INTERPOSER
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Patent #:
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NONE
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Issue Dt:
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Application #:
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12078206
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Filing Dt:
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03/28/2008
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Publication #:
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Pub Dt:
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10/01/2009
| | | | |
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Title:
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Circuitized, multilayer substrate
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Patent #:
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Issue Dt:
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01/12/2010
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Application #:
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12081042
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Filing Dt:
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04/10/2008
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Publication #:
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Pub Dt:
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08/14/2008
| | | | |
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Title:
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MULTILAYERED CIRCUITIZED SUBSTRATE WITH P-ARAMID DIELECTRIC LAYERS AND METHOD OF MAKING SAME
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Patent #:
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Issue Dt:
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12/27/2011
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Application #:
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12081051
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Filing Dt:
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04/10/2008
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Publication #:
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Pub Dt:
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08/14/2008
| | | | |
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Title:
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CIRCUITIZED SUBSTRATE WITH CONTINUOUS THERMOPLASTIC SUPPORT FILM DIELECTRIC LAYERS
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Patent #:
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Issue Dt:
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11/23/2010
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Application #:
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12148271
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Filing Dt:
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04/17/2008
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Publication #:
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Pub Dt:
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10/23/2008
| | | | |
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Title:
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CIRCUITIZED SUBSTRATES UTILIZING SMOOTH-SIDED CONDUCTIVE LAYERS AS PART THEREOF
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Patent #:
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Issue Dt:
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10/04/2011
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Application #:
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12215079
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Filing Dt:
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06/25/2008
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Publication #:
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Pub Dt:
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12/31/2009
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Title:
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SPRING ACTUATED CLAMPING MECHANISM
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Patent #:
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Issue Dt:
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09/07/2010
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Application #:
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12283146
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Filing Dt:
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09/09/2008
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Publication #:
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Pub Dt:
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03/11/2010
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Title:
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MULTI-LAYER EMBEDDED CAPACITANCE AND RESISTANCE SUBSTRATE CORE
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Patent #:
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Issue Dt:
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09/28/2010
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Application #:
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12380616
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Filing Dt:
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03/02/2009
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Publication #:
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Pub Dt:
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08/20/2009
| | | | |
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Title:
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CAPACITIVE SUBSTRATE AND METHOD OF MAKING SAME
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Patent #:
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Issue Dt:
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07/03/2012
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Application #:
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12380617
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Filing Dt:
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03/02/2009
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Publication #:
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Pub Dt:
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07/09/2009
| | | | |
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Title:
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MULTILAYERED CIRCUITIZED SUBSTRATE WITH P-ARAMID DIELECTRIC LAYERS AND METHOD OF MAKING SAME
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Patent #:
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Issue Dt:
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08/06/2013
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Application #:
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12380618
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Filing Dt:
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03/02/2009
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Publication #:
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Pub Dt:
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07/09/2009
| | | | |
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Title:
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METHOD OF MAKING HALOGEN-FREE CIRCUITIZED SUBSTRATE WITH REDUCED THERMAL EXPANSION
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Patent #:
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NONE
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Issue Dt:
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Application #:
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12380637
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Filing Dt:
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03/02/2009
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Publication #:
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Pub Dt:
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10/15/2009
| | | | |
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Title:
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Method of making a circuitized substrate with continuous thermoplastic support film dielectric layers
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Patent #:
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NONE
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Issue Dt:
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Application #:
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12460975
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Filing Dt:
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07/27/2009
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Publication #:
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Pub Dt:
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01/27/2011
| | | | |
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Title:
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Photosensitive dielectric film
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Patent #:
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Issue Dt:
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08/16/2016
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Application #:
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12589239
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Filing Dt:
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10/20/2009
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Publication #:
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Pub Dt:
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02/17/2011
| | | | |
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Title:
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Method of making a circuitized substrate
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Patent #:
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Issue Dt:
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03/26/2013
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Application #:
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12592682
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Filing Dt:
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11/30/2009
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Publication #:
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Pub Dt:
|
06/02/2011
| | | | |
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Title:
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ELECTRONIC PACKAGE INCLUDING HIGH DENSITY INTERPOSER AND CIRCUITIZED SUBSTRATE ASSEMBLY UTILIZING SAME
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Patent #:
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Issue Dt:
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08/21/2012
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Application #:
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12592734
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Filing Dt:
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12/01/2009
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Publication #:
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Pub Dt:
|
06/02/2011
| | | | |
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Title:
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METHOD OF MAKING HIGH DENSITY INTERPOSER AND ELECTRONIC PACKAGE UTILIZING SAME
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Patent #:
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Issue Dt:
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07/12/2011
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Application #:
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12657394
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Filing Dt:
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01/20/2010
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Publication #:
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Pub Dt:
|
07/21/2011
| | | | |
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Title:
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METHOD FOR MAKING CIRCUITIZED SUBSTRATES HAVING PHOTO-IMAGEABLE DIELECTRIC LAYERS IN A CONTINUOUS MANNER
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Patent #:
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Issue Dt:
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03/27/2012
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Application #:
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12720849
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Filing Dt:
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03/10/2010
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Publication #:
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Pub Dt:
|
07/01/2010
| | | | |
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Title:
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MULTI-LAYER EMBEDDED CAPACITANCE AND RESISTANCE SUBSTRATE CORE
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Patent #:
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Issue Dt:
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09/24/2013
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Application #:
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12764993
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Filing Dt:
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04/22/2010
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Publication #:
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Pub Dt:
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06/28/2012
| | | | |
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Title:
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CORELESS LAYER BUILDUP STRUCTURE
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Patent #:
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Issue Dt:
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09/17/2013
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Application #:
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12764994
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Filing Dt:
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04/22/2010
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Publication #:
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Pub Dt:
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06/28/2012
| | | | |
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Title:
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CORELESS LAYER BUILDUP STRUCTURE WITH LGA
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Patent #:
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Issue Dt:
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05/24/2016
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Application #:
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12764997
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Filing Dt:
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04/22/2010
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Publication #:
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Pub Dt:
|
02/09/2012
| | | | |
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Title:
|
CORELESS LAYER BUILDUP STRUCTURE WITH LGA AND JOINING LAYER
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Patent #:
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NONE
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Issue Dt:
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Application #:
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12765110
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Filing Dt:
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04/22/2010
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Publication #:
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Pub Dt:
|
10/27/2011
| | | | |
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Title:
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METHOD FOR VIA PLATING IN ELECTRONIC PACKAGES CONTAINING FLUOROPOLYMER DIELECTRIC LAYERS
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Patent #:
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Issue Dt:
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06/12/2012
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Application #:
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12782187
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Filing Dt:
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05/18/2010
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Publication #:
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Pub Dt:
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11/24/2011
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Title:
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POWER CORE FOR USE IN CIRCUITIZED SUBSTRATE AND METHOD OF MAKING SAME
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Patent #:
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Issue Dt:
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07/05/2011
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Application #:
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12789642
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Filing Dt:
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05/28/2010
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Publication #:
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Pub Dt:
|
12/23/2010
| | | | |
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Title:
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HIGH DENSITY CONNECTOR FOR INTERCONNECTING FINE PITCH CIRCUIT PACKAGING STRUCTURES
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Patent #:
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Issue Dt:
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06/12/2012
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Application #:
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12836612
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Filing Dt:
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08/13/2010
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Publication #:
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Pub Dt:
|
02/16/2012
| | | | |
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Title:
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SEMI-CONDUCTOR CHIP WITH COMPRESSIBLE CONTACT STRUCTURE AND ELECTRONIC PACKAGE UTILIZING SAME
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Patent #:
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NONE
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Issue Dt:
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Application #:
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12837584
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Filing Dt:
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07/16/2010
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Publication #:
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Pub Dt:
|
01/19/2012
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Title:
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METHOD OF FORMING FIBROUS LAMINATE CHIP CARRIER STRUCTURES
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Patent #:
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Issue Dt:
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08/14/2012
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Application #:
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12837640
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Filing Dt:
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07/16/2010
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Publication #:
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Pub Dt:
|
01/19/2012
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Title:
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A METHOD OF JOINING A SEMICONDUCTOR DEVICE/CHIP TO A PRINTED WIRING BOARD
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Patent #:
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Issue Dt:
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08/14/2012
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Application #:
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12854252
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Filing Dt:
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08/11/2010
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Publication #:
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Pub Dt:
|
12/30/2010
| | | | |
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Title:
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CIRCUITIZED SUBSTRATES UTILIZING SMOOTH-SIDED CONDUCTIVE LAYERS AS PART THEREOF
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Patent #:
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Issue Dt:
|
03/27/2012
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Application #:
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12884392
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Filing Dt:
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09/17/2010
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Publication #:
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Pub Dt:
|
03/22/2012
| | | | |
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Title:
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LIQUID CRYSTAL POLYMER LAYER FOR ENCAPSULATION AND IMPROVED HERMITICITY OF CIRCUITIZED SUBSTRATES
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Patent #:
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Issue Dt:
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10/16/2012
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Application #:
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12884421
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Filing Dt:
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09/17/2010
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Publication #:
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Pub Dt:
|
03/22/2012
| | | | |
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Title:
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ANTI-TAMPER MICROCHIP PACKAGE BASED ON THERMAL NANOFLUIDS OR FLUIDS
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Patent #:
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Issue Dt:
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04/01/2014
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Application #:
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12884657
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Filing Dt:
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09/17/2010
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Publication #:
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Pub Dt:
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03/22/2012
| | | | |
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Title:
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CONDUCTING PASTE FOR DEVICE LEVEL INTERCONNECTS
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Patent #:
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NONE
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Issue Dt:
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Application #:
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12904305
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Filing Dt:
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10/14/2010
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Publication #:
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Pub Dt:
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09/27/2012
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Title:
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LAND GRID ARRAY (LGA) CONTACT CONNECTOR MODIFICATION
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Patent #:
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Issue Dt:
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08/06/2013
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Application #:
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12909983
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Filing Dt:
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10/22/2010
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Publication #:
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Pub Dt:
|
09/06/2012
| | | | |
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Title:
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METHOD OF FORMING MULTILAYER CAPACITORS IN A PRINTED CIRCUIT SUBSTRATE
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Patent #:
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NONE
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Issue Dt:
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Application #:
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12910020
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Filing Dt:
|
10/22/2010
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|
Publication #:
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|
Pub Dt:
|
06/28/2012
| | | | |
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Title:
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ELECTRONIC PACKAGE AND METHOD OF MAKING SAME
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Patent #:
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Issue Dt:
|
08/21/2012
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Application #:
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12938759
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Filing Dt:
|
11/03/2010
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|
Publication #:
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|
Pub Dt:
|
02/24/2011
| | | | |
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Title:
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METHOD OF MAKING CIRCUITIZED SUBSTRATE WITH RESISTOR INCLUDING MATERIAL WITH METAL COMPONENT AND ELECTRICAL ASSEMBLY AND INFORMATION HANDLING SYSTEM UTILIZING SAID CIRCUITIZED SUBSTRATE
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|
Patent #:
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NONE
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Issue Dt:
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|
Application #:
|
12939659
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Filing Dt:
|
11/04/2010
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|
Publication #:
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|
Pub Dt:
|
05/10/2012
| | | | |
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Title:
|
HIGH BANDWIDTH SEMICONDUCTOR BALL GRID ARRAY PACKAGE
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Patent #:
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Issue Dt:
|
10/30/2012
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Application #:
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12972700
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Filing Dt:
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12/20/2010
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|
Publication #:
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Pub Dt:
|
06/21/2012
| | | | |
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Title:
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CIRCUITIZED SUBSTRATE WITH DIELECTRIC INTERPOSER ASSEMBLY AND METHOD
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Patent #:
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NONE
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Issue Dt:
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Application #:
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13009922
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Filing Dt:
|
01/20/2011
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Publication #:
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|
Pub Dt:
|
09/27/2012
| | | | |
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Title:
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CONDUCTIVE METAL NUB FOR ENHANCED ELECTRICAL INTERCONNECTION, AND INFORMATION HANDLING SYSTEM UTILIZING SAME
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Patent #:
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Issue Dt:
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10/15/2013
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Application #:
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13022654
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Filing Dt:
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02/08/2011
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|
Publication #:
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Pub Dt:
|
08/09/2012
| | | | |
|
Title:
|
ELECTRONIC PACKAGE WITH THERMAL INTERPOSER AND METHOD OF MAKING SAME
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Patent #:
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NONE
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Issue Dt:
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Application #:
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13041655
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Filing Dt:
|
03/07/2011
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09/13/2012
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Title:
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DEFECTIVE CONDUCTIVE SURFACE PAD REPAIR FOR MICROELECTRONIC CIRCUIT CARDS
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NONE
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13042578
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03/08/2011
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09/13/2012
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Title:
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CIRCUITIZED SUBSTRATE WITH INTERNAL THIN FILM CAPACITOR AND METHOD OF MAKING SAME
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07/23/2013
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13082444
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04/08/2011
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10/11/2012
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METHOD OF CAVITY FORMING ON A BURIED RESISTOR LAYER USING A FUSION BONDING PROCESS
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NONE
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13082502
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04/08/2011
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10/11/2012
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CONDUCTIVE METAL MICRO-PILLARS FOR ENHANCED ELECTRICAL INTERCONNECTION
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NONE
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13082599
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04/08/2011
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10/11/2012
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MODULAR, DETACHABLE COMPUTE LEAF FOR USE WITH COMPUTING SYSTEM
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06/12/2012
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13090676
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04/20/2011
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08/18/2011
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Title:
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METHOD OF APPLYING FORCE TO ELECTRICAL CONTACTS ON A PRINTED CIRCUIT BOARD
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08/06/2013
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13184699
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07/18/2011
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A METHOD OF FORMING AN ELECTRICALLY CONDUCTIVE PRINTED LINE
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NONE
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13189980
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07/25/2011
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01/31/2013
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Title:
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THERMAL SUBSTRATE
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NONE
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13197804
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08/04/2011
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02/07/2013
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Title:
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LIQUID CRYSTAL POLYMER (LCP) SURFACE LAYER ADHESION ENHANCEMENT
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09/20/2016
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13198756
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08/05/2011
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02/07/2013
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Title:
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ELECTRICALLY CONDUCTIVE ADHESIVE (ECA) FOR MULTILAYER DEVICE INTERCONNECTS
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09/05/2017
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13252256
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10/04/2011
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01/26/2012
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Title:
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METHOD OF MAKING A CIRCUITIZED SUBSTRATE
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05/21/2013
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13269770
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10/10/2011
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CIRCUITIZED SUBSTRATE WITH LOW LOSS CAPACITIVE MATERIAL AND METHOD OF MAKING SAME
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11/26/2013
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13358716
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01/26/2012
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SOLDER AND ELECTRICALLY CONDUCTIVE ADHESIVE BASED INTERCONNECTION FOR CZT CRYSTAL ATTACH
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06/03/2014
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13442957
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04/10/2012
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10/10/2013
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METHOD OF MAKING A SEMICONDUCTOR RADIATION DETECTOR
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12/17/2013
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13517776
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06/14/2012
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Title:
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SUBSTRATE HAVING INTERNAL CAPACITOR AND METHOD OF MAKING SAME
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