Patent Assignment Details
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| Reel/Frame: | 035499/0660 | |
| Pages: | 2 |
| | Recorded: | 04/27/2015 | | |
| Attorney Dkt #: | 11274.0023 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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03/20/2018
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Application #:
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14695621
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Filing Dt:
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04/24/2015
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Publication #:
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Pub Dt:
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08/20/2015
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Title:
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SUBSTRATE ALIGNING APPARATUS, SUBSTRATE BONDING APPARATUS, SUBSTRATE ALIGNING METHOD AND SUBSTRATE BONDING METHOD
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Assignee
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| 12-1, YURAKUCHO 1-CHOME, CHIYODA-KU |
| TOKYO, JAPAN 100-8331 |
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Correspondence name and address
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FINNEGAN, HENDERSON, ET AL.
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901 NEW YORK AVENUE
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WASHINGTON, DC 20001
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