Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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Reel/Frame: | 035521/0262 | |
| Pages: | 6 |
| | Recorded: | 04/29/2015 | | |
Attorney Dkt #: | 146024/1173-225 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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01/16/2018
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Application #:
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14639511
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Filing Dt:
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03/05/2015
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Publication #:
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Pub Dt:
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09/08/2016
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Title:
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THROUGH-SILICON VIA (TSV) CRACK SENSORS FOR DETECTING TSV CRACKS IN THREE-DIMENSIONAL (3D) INTEGRATED CIRCUITS (ICs) (3DICs), AND RELATED METHODS AND SYSTEMS
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Assignee
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5775 MOREHOUSE DRIVE |
SAN DIEGO, CALIFORNIA 92121 |
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Correspondence name and address
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W&T/QUALCOMM
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100 REGENCY FOREST DRIVE
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SUITE 160
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CARY, NC 27518
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05/21/2024 01:40 PM
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