Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
| Reel/Frame: | 035570/0687 | |
| Pages: | 3 |
| | Recorded: | 05/06/2015 | | |
| Attorney Dkt #: | SAE-1502-USDIV |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
|
|
Total properties:
1
|
|
|
|
Patent #:
|
|
Issue Dt:
|
06/13/2017
|
Application #:
|
14702785
|
Filing Dt:
|
05/04/2015
|
|
Publication #:
|
|
Pub Dt:
|
08/20/2015
| | | | |
|
Title:
|
WAFER-LEVEL PACKAGED OPTICAL SUBASSEMBLY AND TRANSCEIVER MODULE HAVING SAME
|
|
|
Assignee
|
|
|
|
|
| SAE TECHNOLOGY CENTRE, 6 SCIENCE PARK EAST AVENUE, HONG KONG SCIENCE PARK, SHATIN, N.T. |
| HONG KONG, HONG KONG |
|
|
Correspondence name and address
|
| |
B.Y.I.P., LTD
|
| |
P.O. BOX 1484 OF GENERAL POST OFFICE
|
| |
HONG KONG, HONG KONG
|
Search Results as of:
05/09/2024 07:49 AM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
