Patent Assignment Details
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| Reel/Frame: | 035570/0940 | |
| Pages: | 6 |
| | Recorded: | 05/06/2015 | | |
| Attorney Dkt #: | 2014P15801US |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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05/26/2020
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Application #:
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14552539
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Filing Dt:
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11/25/2014
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Publication #:
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Pub Dt:
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05/26/2016
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Title:
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Compressed Sensing Reconstruction for Multi-Slice and Multi-Slab Acquisitions
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Assignee
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| 3501 QUADRANGLE BLVD. STE. 230 |
| ORLANDO, FLORIDA 32817 |
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Correspondence name and address
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SIEMENS CORPORATION
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3501 QUADRANGLE BLVD. STE. 230
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IPD
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ORLANDO, FL 32817
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