Patent Assignment Details
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Reel/Frame: | 035727/0546 | |
| Pages: | 12 |
| | Recorded: | 05/19/2015 | | |
Attorney Dkt #: | 243275.000007 |
Conveyance: | CHANGE OF NAME (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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08/18/2015
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Application #:
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13349155
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Filing Dt:
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01/12/2012
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Publication #:
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Pub Dt:
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05/03/2012
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Title:
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BONDING WIRE FOR SEMICONDUCTOR DEVICE
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Assignee
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16-3, GINZA 7-CHOME, CHUO-KU |
TOKYO, JAPAN 1040061 |
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Correspondence name and address
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TROUTMAN SANDERS LLP
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875 THIRD AVENUE
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NEW YORK, NY 10022
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