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Total properties:
22
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Patent #:
|
|
Issue Dt:
|
09/07/1999
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Application #:
|
08663800
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Filing Dt:
|
06/14/1996
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Title:
|
SEMISOLID THERMAL INTERFACE WITH LOW FLOW RESISTANCE
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|
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Patent #:
|
|
Issue Dt:
|
07/18/2000
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Application #:
|
08848955
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Filing Dt:
|
04/30/1997
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Title:
|
THERMALLY CONDUCTIVE FILLED POLYMER COMPOSITES FOR MOUNTING ELECTRONIC DEVICES AND METHOD OF APPLICATION
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|
|
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Patent #:
|
|
Issue Dt:
|
03/06/2001
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Application #:
|
09016768
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Filing Dt:
|
01/30/1998
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|
Title:
|
"THERMAL INTERFACES FOR ELECTRONIC DEVICES"
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|
|
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Patent #:
|
|
Issue Dt:
|
01/15/2002
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Application #:
|
09543661
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Filing Dt:
|
04/05/2000
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|
Title:
|
Method of preparing thermally conductive compounds by liquid metal bridged particle clusters
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|
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Patent #:
|
|
Issue Dt:
|
09/23/2003
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Application #:
|
09690994
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Filing Dt:
|
10/17/2000
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Title:
|
METHOD OF PREPARING THERMALLY CONDUCTIVE COMPOUNDS BY LIQUID METAL BRIDGED PARTICLE CLUSTERS
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Patent #:
|
|
Issue Dt:
|
09/28/2004
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Application #:
|
09946879
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Filing Dt:
|
09/05/2001
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Publication #:
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Pub Dt:
|
02/06/2003
| | | | |
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Title:
|
MORPHING FILLERS AND THERMAL INTERFACE MATERIALS
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|
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Patent #:
|
|
Issue Dt:
|
11/18/2003
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Application #:
|
10172877
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Filing Dt:
|
06/17/2002
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|
Title:
|
FINNED HEAT SINKS
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|
|
|
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Patent #:
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|
Issue Dt:
|
12/02/2003
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Application #:
|
10219210
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Filing Dt:
|
08/15/2002
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Title:
|
FLEXIBLE SURFACE LAYER FILM FOR DELIVERY OF HIGHLY FILLED OR LOW CROSS-LINKED THERMALLY CONDUCTIVE INTERFACE PADS
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|
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Patent #:
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|
Issue Dt:
|
01/10/2006
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Application #:
|
10279593
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Filing Dt:
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10/24/2002
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Publication #:
|
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Pub Dt:
|
10/02/2003
| | | | |
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Title:
|
THERMAL INTERFACE PAD UTILIZING LOW MELTING METAL WITH RETENTION MATRIX
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|
|
|
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Patent #:
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|
Issue Dt:
|
05/24/2005
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Application #:
|
10621697
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Filing Dt:
|
07/17/2003
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|
Publication #:
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Pub Dt:
|
01/20/2005
| | | | |
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Title:
|
THERMAL DIFFUSION APPARATUS
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|
|
|
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Patent #:
|
|
Issue Dt:
|
01/01/2008
|
Application #:
|
11122210
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Filing Dt:
|
05/04/2005
|
|
Title:
|
MORPHING FILLERS AND THERMAL INTERFACE MATERIALS
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|
|
|
|
Patent #:
|
|
Issue Dt:
|
07/20/2010
|
Application #:
|
11964197
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Filing Dt:
|
12/26/2007
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|
Publication #:
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|
Pub Dt:
|
07/02/2009
| | | | |
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Title:
|
THERMALLY AND ELECTRICALLY CONDUCTIVE INTERCONNECT STRUCTURES
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|
|
|
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Patent #:
|
|
Issue Dt:
|
12/13/2011
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Application #:
|
11964219
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Filing Dt:
|
12/26/2007
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|
Publication #:
|
|
Pub Dt:
|
07/02/2009
| | | | |
|
Title:
|
THERMAL INTERFACE WITH NON-TACKY SURFACE
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|
|
|
|
Patent #:
|
|
Issue Dt:
|
06/26/2012
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Application #:
|
12469053
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Filing Dt:
|
05/20/2009
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|
Publication #:
|
|
Pub Dt:
|
11/25/2010
| | | | |
|
Title:
|
METHOD FOR PACKAGING THERMAL INTERFACE MATERIALS
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|
|
|
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Patent #:
|
|
Issue Dt:
|
02/07/2012
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Application #:
|
12858849
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Filing Dt:
|
08/18/2010
|
|
Publication #:
|
|
Pub Dt:
|
12/09/2010
| | | | |
|
Title:
|
THERMAL INTERFACE WITH NON-TACKY SURFACE
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|
|
|
|
Patent #:
|
|
Issue Dt:
|
04/30/2013
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Application #:
|
13084706
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Filing Dt:
|
04/12/2011
|
|
Publication #:
|
|
Pub Dt:
|
08/04/2011
| | | | |
|
Title:
|
Method for Packaging Thermal Interface Materials
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|
|
|
|
Patent #:
|
|
Issue Dt:
|
06/12/2018
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Application #:
|
13733668
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Filing Dt:
|
01/03/2013
|
|
Publication #:
|
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Pub Dt:
|
07/03/2014
| | | | |
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Title:
|
THERMALLY CONDUCTIVE EMI SUPPRESSION COMPOSITIONS
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|
|
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Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
13855268
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Filing Dt:
|
04/02/2013
|
|
Publication #:
|
|
Pub Dt:
|
08/29/2013
| | | | |
|
Title:
|
Method for Packaging Thermal Interface Materials
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|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
14085391
|
Filing Dt:
|
11/20/2013
|
|
Publication #:
|
|
Pub Dt:
|
05/21/2015
| | | | |
|
Title:
|
Battery Cell Coatings
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
06/27/2017
|
Application #:
|
14310231
|
Filing Dt:
|
06/20/2014
|
|
Publication #:
|
|
Pub Dt:
|
12/25/2014
| | | | |
|
Title:
|
Thermally Conductive Dielectric Interface
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
04/04/2017
|
Application #:
|
14328834
|
Filing Dt:
|
07/11/2014
|
|
Publication #:
|
|
Pub Dt:
|
01/14/2016
| | | | |
|
Title:
|
Thermal Interface Material with Mixed Aspect Ratio Particle Dispersions
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|
|
|
|
Patent #:
|
|
Issue Dt:
|
06/28/2016
|
Application #:
|
14505557
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Filing Dt:
|
10/03/2014
|
|
Publication #:
|
|
Pub Dt:
|
04/07/2016
| | | | |
|
Title:
|
Laminate Sub-Mounts for LED Surface Mount Package
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|
