Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
| Reel/Frame: | 035819/0213 | |
| Pages: | 3 |
| | Recorded: | 06/10/2015 | | |
| Attorney Dkt #: | HOK-0638 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
|
|
Total properties:
1
|
|
|
|
Patent #:
|
|
Issue Dt:
|
12/05/2017
|
Application #:
|
14651193
|
Filing Dt:
|
06/10/2015
|
|
Publication #:
|
|
Pub Dt:
|
11/24/2016
| | | | |
|
Title:
|
LIQUID SOLDER RESIST COMPOSITION AND COVERED-PRINTED WIRING BOARD
|
|
|
Assignee
|
|
|
|
|
| 58, IJIRI, ISEDA-CHO |
| UJI-SHI, KYOTO, JAPAN 611-0043 |
|
|
Correspondence name and address
|
| |
LEE CHENG
|
| |
1100 17TH STREET N.W. STE 310
|
| |
WASHINGTON, DC 20036
|
Search Results as of:
05/02/2024 11:44 AM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
