Patent Assignment Details
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| Reel/Frame: | 035843/0107 | |
| Pages: | 8 |
| | Recorded: | 06/16/2015 | | |
| Attorney Dkt #: | 293/1098 |
| Conveyance: | CORRECTIVE ASSIGNMENT TO CORRECT THE NAMES OF SECOND AND
THIRD INVENTORS PREVIOUSLY RECORDED ON REEL 035589 FRAME 0866. ASSIGNOR(S) HEREBY CONFIRMS THE NAMES OF SECOND AND
THIRD INVENTORS ARE EUN JUNG LEE AND YONG
HAN CHO. |
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Total properties:
1
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Patent #:
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Issue Dt:
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06/06/2017
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Application #:
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14706663
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Filing Dt:
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05/07/2015
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Publication #:
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Pub Dt:
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03/31/2016
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Title:
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EPOXY RESIN COMPOSITION FOR ENCAPSULATING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE ENCAPSULATED USING THE SAME
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Assignee
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| 150-20, GONGSE-RO, GIHEUNG-GU |
| YONGIN-SI, GYEONGGI-DO, KOREA, REPUBLIC OF 446-902 |
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Correspondence name and address
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LEE & MORSE, P.C.
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3141 FAIRVIEW PARK DRIVE, SUITE 500
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FALLS CHURCH, VA 22042
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