Patent Assignment Details
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Reel/Frame: | 035867/0322 | |
| Pages: | 7 |
| | Recorded: | 06/09/2015 | | |
Attorney Dkt #: | NCA-005 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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05/16/2017
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Application #:
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14703476
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Filing Dt:
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05/04/2015
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Publication #:
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Pub Dt:
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02/04/2016
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Title:
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HEAT DISSIPATION SOLUTION FOR ADVANCED CHIP PACKAGES
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Assignee
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D1, CHINA NETWORK INT'L INNOVATION PARK |
200 LINGHU BOULEVARD |
WUXI, JIANGSU, CHINA 214135 |
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Correspondence name and address
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GOODWIN PROCTER LLP-PATENT ADMINISTRATOR
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53 STATE STREET
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BOSTON, MA 02109
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05/17/2024 08:52 AM
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