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Reel/Frame:035870/0158   Pages: 4
Recorded: 06/19/2015
Attorney Dkt #:112753.04971US
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 21
1
Patent #:
8561664
Issue Dt:
10/22/2013
Application #:
12880383
Filing Dt:
09/13/2010
Publication #:
US20110308738
Pub Dt:
12/22/2011
Title:
DIE BONDER, PICKUP METHOD, AND PICKUP DEVICE
2
Patent #:
8593261
Issue Dt:
11/26/2013
Application #:
13043820
Filing Dt:
03/09/2011
Publication #:
US20120075079
Pub Dt:
03/29/2012
Title:
Tool Management Method of Die Bonder and Die Bonder
3
Patent #:
8456126
Issue Dt:
06/04/2013
Application #:
13044000
Filing Dt:
03/09/2011
Publication #:
US20120212171
Pub Dt:
08/23/2012
Title:
MOTOR CONTROL SYSTEM AND MOTOR CONTROL METHOD
4
Patent #:
8540001
Issue Dt:
09/24/2013
Application #:
13044148
Filing Dt:
03/09/2011
Publication #:
US20120214258
Pub Dt:
08/23/2012
Title:
DIE BONDER AND SEMICONDUCTOR MANUFACTURING METHOD
5
Patent #:
9343338
Issue Dt:
05/17/2016
Application #:
13224366
Filing Dt:
09/02/2011
Publication #:
US20120244647
Pub Dt:
09/27/2012
Title:
Pick-Up Method of Die Bonder and Die Bonder
6
Patent #:
9099524
Issue Dt:
08/04/2015
Application #:
13224511
Filing Dt:
09/02/2011
Publication #:
US20130016205
Pub Dt:
01/17/2013
Title:
DIE BONDER
7
Patent #:
8783319
Issue Dt:
07/22/2014
Application #:
13224536
Filing Dt:
09/02/2011
Publication #:
US20120241096
Pub Dt:
09/27/2012
Title:
Foreign Substance Removing Device and Die Bonder Equipped with the Same
8
Patent #:
8965572
Issue Dt:
02/24/2015
Application #:
13224789
Filing Dt:
09/02/2011
Publication #:
US20130017040
Pub Dt:
01/17/2013
Title:
FRAME FEEDING SYSTEM AND FRAME FEEDING METHOD
9
Patent #:
NONE
Issue Dt:
Application #:
13226128
Filing Dt:
09/06/2011
Publication #:
US20130014904
Pub Dt:
01/17/2013
Title:
Biaxial Drive Mechanism and Die Bonder
10
Patent #:
NONE
Issue Dt:
Application #:
13226138
Filing Dt:
09/06/2011
Publication #:
US20130014881
Pub Dt:
01/17/2013
Title:
Biaxial Drive Mechanism, Die Bonder and Die Bonder Operating Method
11
Patent #:
8991681
Issue Dt:
03/31/2015
Application #:
13412684
Filing Dt:
03/06/2012
Publication #:
US20130068823
Pub Dt:
03/21/2013
Title:
Die Bonder and Bonding Method
12
Patent #:
8460491
Issue Dt:
06/11/2013
Application #:
13414236
Filing Dt:
03/07/2012
Title:
Die Bonder and Bonding Method
13
Patent #:
NONE
Issue Dt:
Application #:
13415920
Filing Dt:
03/09/2012
Publication #:
US20130068826
Pub Dt:
03/21/2013
Title:
Die Bonder and Bonding Method
14
Patent #:
10096526
Issue Dt:
10/09/2018
Application #:
13585900
Filing Dt:
08/15/2012
Publication #:
US20130068824
Pub Dt:
03/21/2013
Title:
Die Bonder and Bonding Method
15
Patent #:
8727202
Issue Dt:
05/20/2014
Application #:
13585905
Filing Dt:
08/15/2012
Publication #:
US20130071956
Pub Dt:
03/21/2013
Title:
DIE BONDER AND BONDING METHOD
16
Patent #:
9324679
Issue Dt:
04/26/2016
Application #:
13587101
Filing Dt:
08/16/2012
Publication #:
US20130221764
Pub Dt:
08/29/2013
Title:
Two-Shaft Drive Mechanism and Die Bonder
17
Patent #:
9245778
Issue Dt:
01/26/2016
Application #:
13779934
Filing Dt:
02/28/2013
Publication #:
US20140060751
Pub Dt:
03/06/2014
Title:
Die Bonding Apparatus, Die Picking Up Apparatus And Die Picking Up Method
18
Patent #:
NONE
Issue Dt:
Application #:
13780065
Filing Dt:
02/28/2013
Publication #:
US20140078289
Pub Dt:
03/20/2014
Title:
Die Bonder and Method of Position Recognition of Die
19
Patent #:
NONE
Issue Dt:
Application #:
13784241
Filing Dt:
03/04/2013
Publication #:
US20140074280
Pub Dt:
03/13/2014
Title:
Horizontal Axis Drive Mechanism, Two-Axis Drive Mechanism, and Die Bonder
20
Patent #:
9362250
Issue Dt:
06/07/2016
Application #:
13784253
Filing Dt:
03/04/2013
Publication #:
US20140069564
Pub Dt:
03/13/2014
Title:
Die Bonder And Bonding Method
21
Patent #:
9318361
Issue Dt:
04/19/2016
Application #:
14104705
Filing Dt:
12/12/2013
Publication #:
US20140251535
Pub Dt:
09/11/2014
Title:
COLLET CLEANING METHOD AND DIE BONDER USING THE SAME
Assignor
1
HITACHI HIGH-TECH INSTRUMENTS CO., LTD.
Exec Dt:
05/26/2015
Assignee
1
FASFORD TECHNOLOGY CO., LTD.
610-5 SHIMOIMASUWA
MINAMI-ALPS CITY, YAMANASHI, JAPAN 400-0212
Correspondence name and address
CROWELL & MORING LLP
P.O. BOX 14300
WASHINGTON, DC 20044-4300

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