Patent Assignment Details
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Reel/Frame: | 035973/0030 | |
| Pages: | 4 |
| | Recorded: | 07/02/2015 | | |
Attorney Dkt #: | A9-120 US |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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08/31/2004
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Application #:
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10059107
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Filing Dt:
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01/31/2002
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Publication #:
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Pub Dt:
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03/20/2003
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Title:
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METHOD FOR ETCHING LAMINATED ASSEMBLY INCLUDING POLYIMIDE LAYER
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Assignee
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11620-45 KIIRE, HITOKURA-CHO |
KAGOSHIMA, JAPAN 891-0204 |
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Correspondence name and address
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MOLEX INCORPORATED
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2222 WELLINGTON COURT
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LISLE, IL 60532
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