Patent Assignment Details
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| Reel/Frame: | 036070/0991 | |
| Pages: | 5 |
| | Recorded: | 07/13/2015 | | |
| Attorney Dkt #: | 086206-0030 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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14396382
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Filing Dt:
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10/22/2014
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Publication #:
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Pub Dt:
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05/14/2015
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Title:
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HIGH-DENSITY MOLDING DEVICE AND HIGH-DENSITY MOLDING METHOD FOR MIXED POWDER
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Assignee
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| 2-10, OHYAMA-CHO, MIDORI-KU |
| SAGAMIHARA-SHI |
| KANAGAWA, JAPAN 252-5181 |
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Correspondence name and address
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MCDERMOTT WILL & EMERY LLP
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THE MCDERMOTT BUILDING
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500 NORTH CAPITOL STREET, N.W.
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WASHINGTON, DC 20001
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