Patent Assignment Details
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Reel/Frame: | 036106/0022 | |
| Pages: | 3 |
| | Recorded: | 07/15/2015 | | |
Attorney Dkt #: | 35008-00003 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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02/27/2018
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Application #:
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14799875
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Filing Dt:
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07/15/2015
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Publication #:
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Pub Dt:
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12/15/2016
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Title:
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METHOD OF MANUFACTURING WAFER LEVEL PACKAGING INCLUDING THROUGH ENCAPSULATION VIAS
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Assignee
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16, BAEKSEOKGONGDAN 7-RO, SEOBUK-GU, CHEONAN-SI |
CHUNGCHEONGNAM-DO, KOREA, REPUBLIC OF 136-729 |
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Correspondence name and address
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NOVAK DRUCE CONNOLLY BOVE + QUIGG LLP
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1875 EYE ST NW
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SUITE 1100
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WASHINGTON, DC 20006-5409
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05/05/2024 01:33 PM
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