Patent Assignment Details
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| Reel/Frame: | 036120/0754 | |
| Pages: | 4 |
| | Recorded: | 07/17/2015 | | |
| Attorney Dkt #: | SHIN 25.713(339243-00040) |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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06/14/2016
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Application #:
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14709761
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Filing Dt:
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05/12/2015
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Publication #:
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Pub Dt:
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08/27/2015
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Title:
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WIRE-BONDING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
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Assignee
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| 51-1, INADAIRA 2-CHOME, MUSASHIMURAYAMA-SHI |
| TOKYO, JAPAN 208-8585 |
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Correspondence name and address
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KATTEN MUCHIN ROSENMAN LLP
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575 MADISON AVENUE
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15TH FLOOR, IP DEPT.
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NEW YORK, NY 10022-2585
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