Patent Assignment Details
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| Reel/Frame: | 036179/0496 | |
| Pages: | 9 |
| | Recorded: | 07/26/2015 | | |
| Attorney Dkt #: | P70808PCT |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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08/22/2017
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Application #:
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14767471
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Filing Dt:
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08/12/2015
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Publication #:
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Pub Dt:
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09/15/2016
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PCT #:
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US2014055612
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Title:
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METHODS TO FORM HIGH DENSITY THROUGH-MOLD INTERCONNECTIONS
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Assignee
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| 2200 MISSION COLLEGE BOULEVARD |
| SANTA CLARA, CALIFORNIA 95054 |
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Correspondence name and address
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WINKLE PLLC
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C/O CPA GLOBAL
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PO BOX 52050
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MINNEAPOLIS, MN 55402
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