Patent Assignment Details
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| Reel/Frame: | 036183/0798 | |
| Pages: | 7 |
| | Recorded: | 07/27/2015 | | |
| Attorney Dkt #: | 036470.00050 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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10/02/2018
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Application #:
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14809533
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Filing Dt:
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07/27/2015
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Publication #:
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Pub Dt:
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11/19/2015
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Title:
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METHOD OF FORMING SOLDER BUMP, AND SOLDER BUMP
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Assignees
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| 10-1 HIGASHIKOTARI 1-CHOME |
| NAGAKAKYO-SHI, KYOTO-FU, JAPAN 617-8555 |
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| 23 SENJUHASHIDOCHO |
| ADACHI-KU, TOKYO, JAPAN 120-8555 |
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Correspondence name and address
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RICHARD LACAVA
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1675 BROADWAY
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ARENT FOX
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NEW YORK, NY 10019
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