Patent Assignment Details
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| Reel/Frame: | 036227/0943 | |
| Pages: | 7 |
| | Recorded: | 07/31/2015 | | |
| Attorney Dkt #: | 2515.0478 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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10/22/2019
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Application #:
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14814906
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Filing Dt:
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07/31/2015
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Publication #:
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Pub Dt:
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02/11/2016
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Title:
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Semiconductor Device and Method of Forming Double-Sided Fan-Out Wafer Level Package
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Assignee
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| 10 ANG MO KIO STREET 65 |
| #05-17/20 TECHPOINT |
| SINGAPORE, SINGAPORE 569059 |
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Correspondence name and address
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STATS CHIPPAC/PATENT LAW GROUP: ATKINS A
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55 N. ARIZONA PLACE, SUITE 104
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CHANDLER, AZ 85225
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