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Reel/Frame:036267/0191   Pages: 5
Recorded: 08/06/2015
Attorney Dkt #:252011-9010
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 21
1
Patent #:
6265779
Issue Dt:
07/24/2001
Application #:
09132608
Filing Dt:
08/11/1998
Title:
METHOD AND MATERIAL FOR INTEGRATION OF FUORINE-CONTAINING LOW-K DIELECTRICS
2
Patent #:
6331481
Issue Dt:
12/18/2001
Application #:
09225477
Filing Dt:
01/04/1999
Title:
DAMASCENE ETCHBACK FOR LOW E DIELECTRIC
3
Patent #:
6911229
Issue Dt:
06/28/2005
Application #:
10215324
Filing Dt:
08/09/2002
Publication #:
US20040028882
Pub Dt:
02/12/2004
Title:
STRUCTURE COMPRISING AN INTERLAYER OF PALLADIUM AND/OR PLATINUM AND METHOD FOR FABRICATION THEREOF
4
Patent #:
6975032
Issue Dt:
12/13/2005
Application #:
10319967
Filing Dt:
12/16/2002
Publication #:
US20040113279
Pub Dt:
06/17/2004
Title:
COPPER RECESS PROCESS WITH APPLICATION TO SELECTIVE CAPPING AND ELECTROLESS PLATING
5
Patent #:
7214608
Issue Dt:
05/08/2007
Application #:
10710706
Filing Dt:
07/29/2004
Publication #:
US20060024961
Pub Dt:
02/02/2006
Title:
INTERLEVEL DIELECTRIC LAYER AND METAL LAYER SEALING
6
Patent #:
7193323
Issue Dt:
03/20/2007
Application #:
10714966
Filing Dt:
11/18/2003
Publication #:
US20050104216
Pub Dt:
05/19/2005
Title:
ELECTROPLATED COWP COMPOSITE STRUCTURES AS COPPER BARRIER LAYERS
7
Patent #:
7411305
Issue Dt:
08/12/2008
Application #:
10908359
Filing Dt:
05/09/2005
Publication #:
US20060249787
Pub Dt:
11/09/2006
Title:
INTERCONNECT STRUCTURE ENCASED WITH HIGH AND LOW K INTERLEVEL DIELECTRICS
8
Patent #:
7217655
Issue Dt:
05/15/2007
Application #:
11047652
Filing Dt:
02/02/2005
Publication #:
US20050127518
Pub Dt:
06/16/2005
Title:
ELECTROPLATED COWP COMPOSITE STRUCTURES AS COPPER BARRIER LAYERS
9
Patent #:
7064064
Issue Dt:
06/20/2006
Application #:
11058783
Filing Dt:
02/16/2005
Publication #:
US20050158985
Pub Dt:
07/21/2005
Title:
COPPER RECESS PROCESS WITH APPLICATION TO SELECTIVE CAPPING AND ELECTROLESS PLATING
10
Patent #:
7245025
Issue Dt:
07/17/2007
Application #:
11164653
Filing Dt:
11/30/2005
Publication #:
US20070120216
Pub Dt:
05/31/2007
Title:
LOW COST BONDING PAD AND METHOD OF FABRICATING SAME
11
Patent #:
7943480
Issue Dt:
05/17/2011
Application #:
12029800
Filing Dt:
02/12/2008
Publication #:
US20090200636
Pub Dt:
08/13/2009
Title:
SUB-LITHOGRAPHIC DIMENSIONED AIR GAP FORMATION AND RELATED STRUCTURE
12
Patent #:
8039964
Issue Dt:
10/18/2011
Application #:
12038241
Filing Dt:
02/27/2008
Publication #:
US20090212439
Pub Dt:
08/27/2009
Title:
FLUORINE DEPLETED ADHESION LAYER FOR METAL INTERCONNECT STRUCTURE
13
Patent #:
7439170
Issue Dt:
10/21/2008
Application #:
12044692
Filing Dt:
03/07/2008
Title:
DESIGN STRUCTURE FOR FINAL VIA DESIGNS FOR CHIP STRESS REDUCTION
14
Patent #:
8129267
Issue Dt:
03/06/2012
Application #:
12052881
Filing Dt:
03/21/2008
Publication #:
US20120028458
Pub Dt:
02/02/2012
Title:
ALPHA PARTICLE BLOCKING WIRE STRUCTURE AND METHOD FABRICATING SAME
15
Patent #:
7521359
Issue Dt:
04/21/2009
Application #:
12054681
Filing Dt:
03/25/2008
Publication #:
US20080169572
Pub Dt:
07/17/2008
Title:
INTERCONNECT STRUCTURE ENCASED WITH HIGH AND LOW K INTERLEVEL DIELECTRICS
16
Patent #:
7545050
Issue Dt:
06/09/2009
Application #:
12183369
Filing Dt:
07/31/2008
Title:
DESIGN STRUCTURE FOR FINAL VIA DESIGNS FOR CHIP STRESS REDUCTION
17
Patent #:
8227918
Issue Dt:
07/24/2012
Application #:
12560769
Filing Dt:
09/16/2009
Publication #:
US20110063815
Pub Dt:
03/17/2011
Title:
ROBUST FBEOL AND UBM STRUCTURE OF C4 INTERCONNECTS
18
Patent #:
8563423
Issue Dt:
10/22/2013
Application #:
13192120
Filing Dt:
07/27/2011
Publication #:
US20110281432
Pub Dt:
11/17/2011
Title:
FLUORINE DEPLETED ADHESION LAYER FOR METAL INTERCONNECT STRUCTURE
19
Patent #:
8450849
Issue Dt:
05/28/2013
Application #:
13478076
Filing Dt:
05/22/2012
Publication #:
US20120286433
Pub Dt:
11/15/2012
Title:
ROBUST FEBOL AND UBM STRUCTURE OF C4 INTERCONNECTS
20
Patent #:
8871636
Issue Dt:
10/28/2014
Application #:
14047521
Filing Dt:
10/07/2013
Publication #:
US20140038407
Pub Dt:
02/06/2014
Title:
FLUORINE DEPLETED ADHESION LAYER FOR METAL INTERCONNECT STRUCTURE
21
Patent #:
8765597
Issue Dt:
07/01/2014
Application #:
14047554
Filing Dt:
10/07/2013
Publication #:
US20140038408
Pub Dt:
02/06/2014
Title:
FLUORINE DEPLETED ADHESION LAYER FOR METAL INTERCONNECT STRUCTURE
Assignor
1
INTERNATIONAL BUSINESS MACHINES CORPORATION
Exec Dt:
09/29/2014
Assignee
1
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
121, PARK AVE.3, SCIENCE-BASED INDUSTRIAL PARK
HSINCHU, TAIWAN 300
Correspondence name and address
MCCLURE, QUALEY & RODACK, LLP
3100 INTERSTATE NORTH CIRCLE
SUITE 150
ATLANTA, GA 30339

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