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Application #:
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10606429
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Filing Dt:
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06/25/2003
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Publication #:
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Pub Dt:
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12/30/2004
| | | | |
Title:
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METHOD OF MANUFACTURING A SEMICONDUCTOR PACKAGE FOR A DIE LARGER THAN A DIE PAD
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Patent #:
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Issue Dt:
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11/22/2005
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Application #:
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10608843
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Filing Dt:
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06/27/2003
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Publication #:
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Pub Dt:
|
03/04/2004
| | | | |
Title:
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METHOD FOR MANUFACTURING PLASTIC BALL GRID ARRAY WITH INTEGRAL HEATSINK
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Patent #:
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Issue Dt:
|
04/25/2006
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Application #:
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10618933
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Filing Dt:
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07/14/2003
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Publication #:
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Pub Dt:
|
10/07/2004
| | | | |
Title:
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SEMICONDUCTOR MULTIPACKAGE MODULE INCLUDING PROCESSOR AND MEMORY PACKAGE ASSEMBLIES
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Patent #:
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Issue Dt:
|
06/20/2006
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Application #:
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10632549
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Filing Dt:
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08/02/2003
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Publication #:
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Pub Dt:
|
04/01/2004
| | | | |
Title:
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SEMICONDUCTOR MULTI-PACKAGE MODULE HAVING WIRE BOND INTERCONNECT BETWEEN STACKED PACKAGES
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Patent #:
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Issue Dt:
|
12/06/2005
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Application #:
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10632550
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Filing Dt:
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08/02/2003
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Publication #:
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Pub Dt:
|
03/25/2004
| | | | |
Title:
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SEMICONDUCTOR MULTI-PACKAGE MODULE INCLUDING STACKED-DIE PACKAGE AND HAVING WIRE BOND INTERCONNECT BETWEEN STACKED PACKAGES
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Patent #:
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Issue Dt:
|
01/04/2005
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Application #:
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10632551
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Filing Dt:
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08/02/2003
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Publication #:
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Pub Dt:
|
04/08/2004
| | | | |
Title:
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SEMICONDUCTOR MULTI-PACKAGE MODULE HAVING WIRE BOND INTERCONNECT BETWEEN STACKED PACKAGES AND HAVING ELECTRICAL SHIELD
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Patent #:
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Issue Dt:
|
05/30/2006
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Application #:
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10632553
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Filing Dt:
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08/02/2003
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Publication #:
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Pub Dt:
|
04/01/2004
| | | | |
Title:
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SEMICONDUCTOR MULTI-PACKAGE MODULE HAVING PACKAGE STACKED OVER DIE-DOWN FLIP CHIP BALL GRID ARRAY PACKAGE AND HAVING WIRE BOND INTERCONNECT BETWEEN STACKED PACKAGES
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Patent #:
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Issue Dt:
|
04/17/2007
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Application #:
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10632568
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Filing Dt:
|
08/02/2003
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Publication #:
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Pub Dt:
|
04/01/2004
| | | | |
Title:
|
SEMICONDUCTOR MULTI-PACKAGE MODULE HAVING PACKAGE STACKED OVER BALL GRID ARRAY PACKAGE AND HAVING WIRE BOND INTERCONNECT BETWEEN STACKED PACKAGES
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Patent #:
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Issue Dt:
|
03/01/2005
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Application #:
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10676736
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Filing Dt:
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09/30/2003
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Publication #:
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Pub Dt:
|
07/29/2004
| | | | |
Title:
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STACKED SEMICONDUCTOR PACKAGES AND METHOD FOR THE FABRICATION THEREOF
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|
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Patent #:
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Issue Dt:
|
06/13/2006
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Application #:
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10681572
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Filing Dt:
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10/08/2003
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Publication #:
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Pub Dt:
|
06/17/2004
| | | | |
Title:
|
SEMICONDUCTOR STACKED MULTI-PACKAGE MODULE HAVING INVERTED SECOND PACKAGE
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|
|
Patent #:
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|
Issue Dt:
|
05/16/2006
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Application #:
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10681583
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Filing Dt:
|
10/08/2003
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Publication #:
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Pub Dt:
|
06/17/2004
| | | | |
Title:
|
SEMICONDUCTOR MULTI-PACKAGE MODULE HAVING INVERTED SECOND PACKAGE STACKED OVER DIE-UP FLIP-CHIP BALL GRID ARRAY (BGA) PACKAGE
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|
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Patent #:
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|
Issue Dt:
|
05/23/2006
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Application #:
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10681584
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Filing Dt:
|
10/08/2003
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Publication #:
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Pub Dt:
|
06/17/2004
| | | | |
Title:
|
SEMICONDUCTOR MULTI-PACKAGE MODULE HAVING INVERTED SECOND PACKAGE AND INCLUDING ADDITIONAL DIE OR STACKED PACKAGE ON SECOND PACKAGE
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|
|
Patent #:
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|
Issue Dt:
|
05/30/2006
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Application #:
|
10681734
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Filing Dt:
|
10/08/2003
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Publication #:
|
|
Pub Dt:
|
06/24/2004
| | | | |
Title:
|
SEMICONDUCTOR MULTI-PACKAGE MODULE HAVING INVERTED BUMP CHIP CARRIER SECOND PACKAGE
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|
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Patent #:
|
|
Issue Dt:
|
06/06/2006
|
Application #:
|
10681735
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Filing Dt:
|
10/08/2003
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Publication #:
|
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Pub Dt:
|
06/24/2004
| | | | |
Title:
|
SEMICONDUCTOR MULTI-PACKAGE MODULE HAVING INVERTED LAND GRID ARRAY (LGA) PACKAGE STACKED OVER BALL GRID ARRAY (BGA) PACKAGE
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|
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Patent #:
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|
Issue Dt:
|
06/14/2005
|
Application #:
|
10681747
|
Filing Dt:
|
10/08/2003
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Publication #:
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|
Pub Dt:
|
06/17/2004
| | | | |
Title:
|
SEMICONDUCTOR MULTI-PACKAGE MODULE HAVING INVERTED SECOND PACKAGE STACKED OVER DIE-UP FLIP-CHIP BALL GRID ARRAY (BGA) PACKAGE
|
|
|
Patent #:
|
|
Issue Dt:
|
08/23/2005
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Application #:
|
10681833
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Filing Dt:
|
10/08/2003
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Publication #:
|
|
Pub Dt:
|
07/01/2004
| | | | |
Title:
|
SEMICONDUCTOR STACKED MULTI-PACKAGE MODULE HAVING INVERTED SECOND PACKAGE AND ELECTRICALLY SHIELDED FIRST PACKAGE
|
|
|
Patent #:
|
|
Issue Dt:
|
02/22/2005
|
Application #:
|
10682273
|
Filing Dt:
|
10/08/2003
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Title:
|
METHOD FOR FABRICATING SEMICONDUCTOR PACKAGES, AND LEADFRAME ASSEMBLIES FOR THE FABRICATION THEREOF
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|
|
Patent #:
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|
Issue Dt:
|
07/25/2006
|
Application #:
|
10693217
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Filing Dt:
|
10/24/2003
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Publication #:
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|
Pub Dt:
|
05/06/2004
| | | | |
Title:
|
FLIP CHIP MOLDED/EXPOSED DIE PROCESS AND PACKAGE STRUCTURE
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|
Patent #:
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|
Issue Dt:
|
07/18/2006
|
Application #:
|
10745149
|
Filing Dt:
|
12/22/2003
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Publication #:
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|
Pub Dt:
|
07/15/2004
| | | | |
Title:
|
MULTI-PACKAGE CONVERSION KIT FOR A PICK AND PLACE HANDLER
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|
Patent #:
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|
Issue Dt:
|
11/16/2004
|
Application #:
|
10765644
|
Filing Dt:
|
01/26/2004
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Publication #:
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|
Pub Dt:
|
08/12/2004
| | | | |
Title:
|
HEAT SPREADER INTERCONNECT FOR THERMALLY ENHANCED PBGA PACKAGES
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|
|
Patent #:
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|
Issue Dt:
|
12/26/2006
|
Application #:
|
10766746
|
Filing Dt:
|
01/27/2004
|
Publication #:
|
|
Pub Dt:
|
07/28/2005
| | | | |
Title:
|
STRIP-FABRICATED FLIP CHIP IN PACKAGE AND FLIP CHIP IN SYSTEM HEAT SPREADER ASSEMBLIES AND FABRICATION METHODS THEREFOR
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|
|
Patent #:
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Issue Dt:
|
02/28/2006
|
Application #:
|
10773716
|
Filing Dt:
|
02/05/2004
|
Publication #:
|
|
Pub Dt:
|
08/11/2005
| | | | |
Title:
|
SEMICONDUCTOR PACKAGE WITH PASSIVE DEVICE INTEGRATION
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|
Patent #:
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Issue Dt:
|
09/06/2005
|
Application #:
|
10791095
|
Filing Dt:
|
03/01/2004
|
Publication #:
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|
Pub Dt:
|
09/16/2004
| | | | |
Title:
|
TORCH BUMP
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|
|
Patent #:
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|
Issue Dt:
|
04/05/2005
|
Application #:
|
10804732
|
Filing Dt:
|
03/18/2004
|
Publication #:
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|
Pub Dt:
|
09/16/2004
| | | | |
Title:
|
HEAT SPREADER ANCHORING AND GROUNDING METHOD AND THERMALLY ENHANCED PBGA PACKAGE USING THE SAME
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|
|
Patent #:
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|
Issue Dt:
|
12/11/2007
|
Application #:
|
10825810
|
Filing Dt:
|
04/16/2004
|
Publication #:
|
|
Pub Dt:
|
10/28/2004
| | | | |
Title:
|
SYSTEM FOR FABRICATING AN INTEGRATED CIRCUIT PACKAGE ON A PRINTED CIRCUIT BOARD
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|
|
Patent #:
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|
Issue Dt:
|
04/17/2007
|
Application #:
|
10825910
|
Filing Dt:
|
04/16/2004
|
Publication #:
|
|
Pub Dt:
|
10/20/2005
| | | | |
Title:
|
THERMALLY ENHANCED STACKED DIE PACKAGE AND FABRICATION METHOD
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|
Patent #:
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Issue Dt:
|
02/05/2008
|
Application #:
|
10836916
|
Filing Dt:
|
04/30/2004
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Publication #:
|
|
Pub Dt:
|
11/03/2005
| | | | |
Title:
|
HEAT SPREADER FOR THERMALLY ENHANCED SEMICONDUCTOR PACKAGE
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|
Patent #:
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|
Issue Dt:
|
10/31/2006
|
Application #:
|
10837347
|
Filing Dt:
|
04/30/2004
|
Publication #:
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|
Pub Dt:
|
11/17/2005
| | | | |
Title:
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LARGE DIE PACKAGE STRUCTURES AND FABRICATION METHOD THEREFOR
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|
Patent #:
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Issue Dt:
|
06/13/2006
|
Application #:
|
10846171
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Filing Dt:
|
05/13/2004
|
Publication #:
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Pub Dt:
|
11/24/2005
| | | | |
Title:
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DUAL ROW LEADFRAME AND FABRICATION METHOD
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Patent #:
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Issue Dt:
|
02/28/2006
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Application #:
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10846176
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Filing Dt:
|
05/13/2004
|
Publication #:
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|
Pub Dt:
|
11/17/2005
| | | | |
Title:
|
METHOD OF MANUFACTURING DIFFERENT BOND PADS ON THE SAME SUBSTRATE OF AN INTEGRATED CIRCUIT PACKAGE
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Patent #:
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Issue Dt:
|
08/09/2011
|
Application #:
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10849947
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Filing Dt:
|
05/20/2004
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Publication #:
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Pub Dt:
|
10/28/2004
| | | | |
Title:
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FLIP CHIP INTERCONNECTION STRUCTURE
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Patent #:
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Issue Dt:
|
04/25/2006
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Application #:
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10850093
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Filing Dt:
|
05/20/2004
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Publication #:
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Pub Dt:
|
10/28/2004
| | | | |
Title:
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FLIP CHIP INTERCONNECTION STRUCTURE
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Patent #:
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Issue Dt:
|
05/15/2007
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Application #:
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10850220
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Filing Dt:
|
05/19/2004
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Publication #:
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Pub Dt:
|
12/16/2004
| | | | |
Title:
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INTEGRATED CIRCUIT PACKAGE WITH LEADFRAME LOCKED ENCAPSULATION AND METHOD OF MANUFACTURE THEREFOR
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Patent #:
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Issue Dt:
|
08/15/2006
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Application #:
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10850934
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Filing Dt:
|
05/20/2004
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Publication #:
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Pub Dt:
|
11/24/2005
| | | | |
Title:
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PACKAGING FOR OPTOELECTRONIC DEVICES
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Patent #:
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|
Issue Dt:
|
03/07/2006
|
Application #:
|
10866561
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Filing Dt:
|
06/10/2004
|
Publication #:
|
|
Pub Dt:
|
12/15/2005
| | | | |
Title:
|
CHIP SCALE PACKAGE WITH OPEN SUBSTRATE
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|