Patent Assignment Details
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| Reel/Frame: | 036379/0643 | |
| Pages: | 4 |
| | Recorded: | 08/20/2015 | | |
| Attorney Dkt #: | T5057-825A |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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05/01/2018
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Application #:
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14830820
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Filing Dt:
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08/20/2015
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Publication #:
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Pub Dt:
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12/10/2015
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Title:
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HYBRID BONDING MECHANISMS FOR SEMICONDUCTOR WAFERS
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Assignee
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| NO. 8, LI-HSIN RD. VI, HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN 300 |
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Correspondence name and address
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LOWE HAUPTMAN & HAM, LLP (TSMC)
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2318 MILL ROAD
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SUITE 1400
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ALEXANDRIA, VA 22314
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