Patent Assignment Details
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| Reel/Frame: | 036477/0004 | |
| Pages: | 4 |
| | Recorded: | 08/25/2015 | | |
| Attorney Dkt #: | 3712174-03319 |
| Conveyance: | CORRECTIVE ASSIGNMENT TO ADD THE SECOND ASSIGNEE'S DATA PREVIOUSLY RECORDED AT REEL: 029373 FRAME: 0610. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. |
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Total properties:
1
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Patent #:
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Issue Dt:
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10/06/2015
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Application #:
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13663211
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Filing Dt:
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10/29/2012
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Publication #:
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Pub Dt:
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05/09/2013
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Title:
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FUSING METHOD OF SUBSTRATE LAYER, MANUFACTURING METHOD OF MICROFLUIDIC CHIP AND FUSING APPARATUS OF SUBSTRATE LAYER
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Assignees
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| 1-7-1 KONAN |
| MINATO-KU, TOKYO, JAPAN |
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| 1-12 KITASHINAGAWA 5-CHOME |
| SHINAGAWA-KU, TOKYO, JAPAN 141-0001 |
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Correspondence name and address
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THOMAS C. BASSO
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P.O. BOX 1135
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CHICAGO, IL 60690-1135
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