Patent Assignment Details
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| Reel/Frame: | 036638/0934 | |
| Pages: | 3 |
| | Recorded: | 09/23/2015 | | |
| Attorney Dkt #: | 854463.426 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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12/12/2017
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Application #:
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14861648
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Filing Dt:
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09/22/2015
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Publication #:
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Pub Dt:
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05/26/2016
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Title:
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PACKAGE FOR SEMICONDUCTOR DEVICES SENSITIVE TO MECHANICAL AND THERMO-MECHANICAL STRESSES, SUCH AS MEMS PRESSURE SENSORS
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Assignee
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| VIA C. OLIVETTI, 2 |
| AGRATE BRIANZA, ITALY 20864 |
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Correspondence name and address
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SEED INTELLECTUAL PROPERTY LAW (EP ORIGI
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701 FIFTH AVENUE, SUITE 5400
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SEATTLE, WA 98104-7092
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