Patent Assignment Details
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| Reel/Frame: | 036718/0022 | |
| Pages: | 3 |
| | Recorded: | 10/02/2015 | | |
| Attorney Dkt #: | 8036-1121 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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12/05/2017
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Application #:
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14782142
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Filing Dt:
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10/02/2015
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Publication #:
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Pub Dt:
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02/25/2016
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Title:
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LEAD-FREE SOLDER ALLOY AND IN-VEHICLE ELECTRONIC CIRCUIT
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Assignee
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| 23, SENJU-HASHIDO-CHO, ADACHI-KU |
| TOKYO, JAPAN 120-8555 |
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Correspondence name and address
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YOUNG & THOMPSON
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209 MADISON STREET
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SUITE 500
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ALEXANDRIA, VA 22314
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