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Reel/Frame:036731/0256   Pages: 3
Recorded: 10/05/2015
Attorney Dkt #:20130989/24061.2632US02
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
06/02/2020
Application #:
14875535
Filing Dt:
10/05/2015
Publication #:
Pub Dt:
01/28/2016
Title:
Method of Semiconductor Integrated Circuit Fabrication
Assignors
1
Exec Dt:
10/17/2013
2
Exec Dt:
10/17/2013
3
Exec Dt:
10/17/2013
Assignee
1
NO. 8, LI-HSIN ROAD 6
SCIENCE-BASED INDUSTRIAL PARK
HSIN-CHU, TAIWAN 300-77
Correspondence name and address
HAYNES AND BOONE, LLP IP SECTION
2323 VICTORY AVENUE
SUITE 700
DALLAS, TX 75219

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