Patent Assignment Details
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| Reel/Frame: | 036777/0782 | |
| Pages: | 5 |
| | Recorded: | 10/13/2015 | | |
| Attorney Dkt #: | 30276.4022 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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03/28/2017
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Application #:
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14778684
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Filing Dt:
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09/21/2015
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Publication #:
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Pub Dt:
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02/18/2016
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Title:
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SEMICONDUCTOR DEVICE AND HEAT-DISSIPATING MECHANISM
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Assignee
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| TOKYO BUILDING 22F |
| 7-3, MARUNOUCHI 2-CHOME |
| CHIYODA-KU, TOKYO, JAPAN 100-6422 |
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Correspondence name and address
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ORRICK, HERRINGTON & SUTCLIFFE LLP
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2050 MAIN STREET, SUITE 1100
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IRVINE, CA 92614
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