Patent Assignment Details
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| Reel/Frame: | 036825/0199 | |
| Pages: | 3 |
| | Recorded: | 10/19/2015 | | |
| Attorney Dkt #: | UC1.PAU.225 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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04/04/2017
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Application #:
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14881058
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Filing Dt:
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10/12/2015
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Publication #:
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Pub Dt:
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06/16/2016
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Title:
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THROUGH-WAFER INTERCONNECTS FOR MEMS DOUBLE-SIDED FABRICATION PROCESS (TWIDS)
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Assignee
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| 1111 FRANKLIN ST. 5TH FLOOR |
| OAKLAND, CALIFORNIA 94607 |
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Correspondence name and address
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DANIEL L. DAWES
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5200 WARNER AVE STE 106
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HUNTINGTON BEACH, CA 92649
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