Patent Assignment Details
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| Reel/Frame: | 036865/0632 | |
| Pages: | 4 |
| | Recorded: | 10/23/2015 | | |
| Attorney Dkt #: | 550718-00145USE/AMG |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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06/25/2019
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Application #:
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14775013
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Filing Dt:
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09/11/2015
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Publication #:
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Pub Dt:
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02/04/2016
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Title:
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SOLDER ALLOY AND JOINT THEREOF
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Assignee
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| 16-15, ESAKA-CHO 1-CHOME |
| SUITA-SHI, OSAKA, JAPAN 5640063 |
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Correspondence name and address
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THEODORE D. LIENESCH
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10050 INNOVATION DRIVE
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SUITE 400
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DAYTON, OH 45342-4934
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