Patent Assignment Details
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Reel/Frame: | 036917/0663 | |
| Pages: | 2 |
| | Recorded: | 10/29/2015 | | |
Attorney Dkt #: | CU-100149 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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09/26/2017
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Application #:
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14927199
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Filing Dt:
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10/29/2015
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Publication #:
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Pub Dt:
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07/28/2016
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Title:
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METHOD OF MANUFACTURING FAN OUT WAFER LEVEL PACKAGE
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Assignee
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NO. 200 LINGHU BLVD. |
BLDG. D1, CHINA SR. NETWORK INT. INNOVATION PARK |
WUXI, JIANGSU PROVINCE, CHINA 214135 |
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Correspondence name and address
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FLENER IP LAW
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300 W. ADAMS ST
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SUITE 840
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CHICAGO, IL 60606
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