Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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Reel/Frame: | 036948/0803 | |
| Pages: | 14 |
| | Recorded: | 11/03/2015 | | |
Attorney Dkt #: | 461411US |
Conveyance: | CONDITIONAL ASSIGNMENT (SEE DOCUMENT FOR DETAILS). |
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Total properties:
3
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Patent #:
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Issue Dt:
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08/18/2015
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Application #:
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13666089
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Filing Dt:
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11/01/2012
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Publication #:
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Pub Dt:
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05/02/2013
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Title:
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LOW COST AND HIGH PERFORMANCE BONDING OF WAFER TO INTERPOSER & METHOD OF FORMING VIAS AND CIRCUITS
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Patent #:
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Issue Dt:
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01/12/2016
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Application #:
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14568842
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Filing Dt:
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12/12/2014
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Title:
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FILLING MATERIALS AND METHODS OF FILLING THROUGH HOLES FOR IMPROVED ADHESION AND HERMETICITY IN GLASS SUBSTRATES AND OTHER ELECTRONIC COMPONENTS
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Patent #:
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Issue Dt:
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06/21/2016
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Application #:
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14568917
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Filing Dt:
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12/12/2014
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Title:
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FILLING MATERIALS AND METHODS OF FILLING THROUGH HOLES FOR IMPROVED ADHESION AND HERMETICITY IN GLASS SUBSTRATES AND OTHER ELECTRONIC COMPONENTS
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Assignee
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5-1, MARUNOUCHI 1-CHOME |
CHIYODA-KU |
TOKYO, JAPAN 100-8405 |
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Correspondence name and address
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OBLON, ET AL.
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1940 DUKE STREET
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ALEXANDRIA, VA 22314
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