Patent Assignment Details
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| Reel/Frame: | 037033/0195 | |
| Pages: | 5 |
| | Recorded: | 11/02/2015 | | |
| Attorney Dkt #: | 2481-0137PUS1 |
| Conveyance: | CORRECTIVE ASSIGNMENT TO CORRECT THE NAME OF THE ASSIGNEE PREVIOUSLY RECORDED ON REEL 026225 FRAME 0642. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. |
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Total properties:
1
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Patent #:
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Issue Dt:
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09/08/2015
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Application #:
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13121584
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Filing Dt:
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05/05/2011
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Publication #:
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Pub Dt:
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08/25/2011
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Title:
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WAFER BONDING DEVICE AND WAFER BONDING METHOD
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Assignee
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| 16-5, KONAN 2-CHOME |
| MINATO-KU, TOKYO, JAPAN |
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Correspondence name and address
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BIRCH, STEWART, KOLASCH & BIRCH, LLP
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8110 GATEHOUSE ROAD, SUITE 100E
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FALLS CHURCH, VA 22042
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