Patent Assignment Details
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| Reel/Frame: | 037046/0074 | |
| Pages: | 6 |
| | Recorded: | 11/16/2015 | | |
| Attorney Dkt #: | 28744-4553 (110019.9) |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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03/27/2018
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Application #:
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14845327
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Filing Dt:
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09/04/2015
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Publication #:
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Pub Dt:
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12/31/2015
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Title:
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CLAMPING APPARATUS FOR CLEAVING A BONDED WAFER STRUCTURE AND METHODS FOR CLEAVING
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Assignee
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| 9 BATTERY ROAD |
| #15-01 STRAITS TRADING BUILDING |
| SINGAPORE, SINGAPORE 049910 |
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Correspondence name and address
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RICHARD A. SCHUTH
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ARMSTRONG TEASDALE LLP
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7700 FORSYTH BOULEVARD, SUITE 1800
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ST. LOUIS, MO 63105
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