Patent Assignment Details
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| Reel/Frame: | 037070/0888 | |
| Pages: | 5 |
| | Recorded: | 11/18/2015 | | |
| Attorney Dkt #: | 2015-1254A |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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14780121
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Filing Dt:
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09/25/2015
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Publication #:
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Pub Dt:
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02/25/2016
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Title:
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ADDITIVE FOR COPPER ELECTROPLATING BATH, COPPER ELECTROPLATING BATH CONTAINING SAID ADDITIVE, AND COPPER ELECTROPLATING METHOD USING SAID COPPER ELECTROPLATING BATH
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Assignee
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| 2-35, HIGASHIOGU 7-CHOME, ARAKAWA-KU |
| TOKYO, JAPAN 116-8554 |
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Correspondence name and address
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WENDEROTH, LIND & PONACK, LLP
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1030 15TH STREET, N.W.
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SUITE 400 EAST
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WASHINGTON, DC 20005
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