Patent Assignment Details
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| Reel/Frame: | 037156/0293 | |
| Pages: | 6 |
| | Recorded: | 11/24/2015 | | |
| Attorney Dkt #: | 151132 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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09/20/2016
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Application #:
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14893651
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Filing Dt:
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11/24/2015
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Publication #:
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Pub Dt:
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04/21/2016
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Title:
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EPOXY RESIN COMPOSITION FOR OPTICAL SEMICONDUCTOR DEVICE, AND LEAD FRAME FOR OPTICAL SEMICONDUCTOR DEVICE, ENCAPSULATION TYPE OPTICAL SEMICONDUCTOR ELEMENT UNIT AND OPTICAL SEMICONDUCTOR DEVICE EACH OBTAINABLE BY USING THE EPOXY RESIN COMPOSITION
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Assignee
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| 1-2, SHIMOHOZUMI 1-CHOME |
| IBARAKI-SHI, OSAKA, JAPAN 567-8680 |
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Correspondence name and address
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WESTERMAN, HATTORI, DANIELS & ADRIAN, LL
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1250 CONNECTICUT AVENUE, NW
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SUITE 700
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WASHINGTON, DC 20036
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