Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
| Reel/Frame: | 037182/0214 | |
| Pages: | 4 |
| | Recorded: | 12/01/2015 | | |
| Attorney Dkt #: | 168795 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
|
|
Total properties:
1
|
|
|
|
Patent #:
|
|
Issue Dt:
|
01/02/2018
|
Application #:
|
14895184
|
Filing Dt:
|
12/01/2015
|
|
Publication #:
|
|
Pub Dt:
|
04/28/2016
| | | | |
|
Title:
|
METHOD OF PRODUCING BONDED WAFER WITH UNIFORM THICKNESS DISTRIBUTION
|
|
|
Assignee
|
|
|
|
|
| 2-1, OHTEMACHI 2-CHOME, CHIYODA-KU |
| TOKYO, JAPAN |
|
|
Correspondence name and address
|
| |
AARON L. WEBB
|
| |
OLIFF PLC
|
| |
P.O. BOX 320850
|
| |
ALEXANDRIA, VA 22320-4850
|
Search Results as of:
04/27/2024 05:28 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
