Patent Assignment Details
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| Reel/Frame: | 037331/0155 | |
| Pages: | 6 |
| | Recorded: | 12/18/2015 | | |
| Attorney Dkt #: | 2271/88272 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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02/13/2018
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Application #:
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14974269
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Filing Dt:
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12/18/2015
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Publication #:
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Pub Dt:
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07/14/2016
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Title:
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SEMICONDUCTIVE RESIN COMPOSITION, MEMBER FOR ELECTROPHOTOGRAPHY AND IMAGE FORMING APPARATUS
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Assignee
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| 3-6, NAKAMAGOME 1-CHOME, OHTA-KU |
| TOKYO, JAPAN 143-8555 |
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Correspondence name and address
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PAUL TENG [2271/88272]
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COOPER & DUNHAM LLP
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30 ROCKEFELLER PLAZA 20TH FLOOR
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NEW YORK, NY 10112
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