Patent Assignment Details
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| Reel/Frame: | 037335/0468 | |
| Pages: | 2 |
| | Recorded: | 12/19/2015 | | |
| Attorney Dkt #: | T9094-21971US01/XA-12997 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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09/26/2017
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Application #:
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14874242
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Filing Dt:
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10/02/2015
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Publication #:
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Pub Dt:
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04/07/2016
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Title:
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CIRCUIT SUBSTRATE FOR SEMICONDUCTOR PACKAGE WITH MULTIPLE CIRCUIT SUBSTRATE UNITS AND SEMICONDUCTOR PACKAGE THEREFOR
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Assignee
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| 2-1, SHIBAURA 1-CHOME |
| MINATO-KU, TOKYO, JAPAN |
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Correspondence name and address
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ERIC G. KING
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MILES & STOCKBRIDGE P.C.
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1751 PINNACLE DRIVE, SUITE 1500
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TYSONS CORNER, VA 22102-3833
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