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Reel/Frame:037366/0512   Pages: 5
Recorded: 12/28/2015
Attorney Dkt #:27-928/27-928P
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
NONE
Issue Dt:
Application #:
14980292
Filing Dt:
12/28/2015
Publication #:
Pub Dt:
06/30/2016
Title:
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH PACKAGE-ON-PACKAGE MECHANISM AND METHOD OF MANUFACTURE THEREOF
Assignors
1
Exec Dt:
12/21/2015
2
Exec Dt:
12/21/2015
3
Exec Dt:
12/21/2015
Assignee
1
10 ANG MO KIO STREET 65
#04-08/09 TECHPOINT
SINGAPORE, SINGAPORE 569059
Correspondence name and address
ISHIMARU & ASSOCIATES LLP
2055 GATEWAY PLACE
SUITE 700
SAN JOSE, CA 95110

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