Patent Assignment Details
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| Reel/Frame: | 037430/0886 | |
| Pages: | 3 |
| | Recorded: | 01/07/2016 | | |
| Attorney Dkt #: | PA2554-0 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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14990144
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Filing Dt:
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01/07/2016
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Publication #:
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Pub Dt:
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02/23/2017
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Title:
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METHODS OF FABRICATING PACKAGE SUBSTRATES HAVING EMBEDDED CIRCUIT PATTERNS
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Assignee
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| 2091, GYEONGCHUNG-DAERO, BUBAL-EUB |
| ICHEON-SI GYEONGGI-DO, KOREA, REPUBLIC OF |
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Correspondence name and address
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WILLIAM PARK & ASSOCIATES LTD.
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930 N. YORK ROAD, SUITE 201
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HINSDALE, IL 60521
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