Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Reel/Frame: | 037436/0264 | |
| Pages: | 6 |
| | Recorded: | 01/08/2016 | | |
Attorney Dkt #: | 239908-381435 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
|
Total properties:
1
|
|
Patent #:
|
|
Issue Dt:
|
04/25/2017
|
Application #:
|
14901483
|
Filing Dt:
|
12/28/2015
|
Publication #:
|
|
Pub Dt:
|
12/22/2016
| | | | |
Title:
|
FIRST-ETCHED AND LATER-PACKAGED THREE-DIMENSIONAL SYSTEM-IN-PACKAGE NORMAL CHIP STACK PACKAGE STRUCTURE AND PROCESSING METHOD THEREOF
|
|
Assignee
|
|
|
NO. 78, CHANGSHAN RD. |
JIANGYIN |
JIANGSU, CHINA 214434 |
|
Correspondence name and address
|
|
MATTHEW H. SZALACH
|
|
350 WEST MICHIGAN AVENUE, SUITE 330
|
|
KALAMAZOO, MI 49007
|
Search Results as of:
05/16/2024 09:19 AM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|