Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Reel/Frame: | 037454/0164 | |
| Pages: | 2 |
| | Recorded: | 01/11/2016 | | |
Attorney Dkt #: | PAC206-0001D US CON |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
|
Total properties:
1
|
|
Patent #:
|
|
Issue Dt:
|
02/16/2016
|
Application #:
|
14457249
|
Filing Dt:
|
08/12/2014
|
Publication #:
|
|
Pub Dt:
|
11/27/2014
| | | | |
Title:
|
METHODS AND MATERIALS USEFUL FOR CHIP STACKING, CHIP AND WAFER BONDING
|
|
Assignee
|
|
|
TENNOZ PARKSIDE BUILDING |
5-8 HIGASHI-SHINAGAWA 2-CHOME |
SHINAGAWA-KU, TOKYO, JAPAN 140-0002 |
|
Correspondence name and address
|
|
BALARAM GUPTA, C/O PROMERUS, LLC
|
|
9921 BRECKSVILLE ROAD
|
|
BUILDING R
|
|
BRECKSVILLE, OH 44141
|
Search Results as of:
05/21/2024 09:25 AM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|