|
Total properties:
15
|
|
|
|
Patent #:
|
|
Issue Dt:
|
04/15/1997
|
Application #:
|
08523580
|
Filing Dt:
|
09/05/1995
|
|
Title:
|
SEGMENTED THICK FILM RESISTORS
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
02/10/1998
|
Application #:
|
08668900
|
Filing Dt:
|
06/24/1996
|
|
Title:
|
THICK-FILM CONDUCTOR COMPOSITIONS COMPRISING SILVER OR PALLADIUM PARTICLES COATED WITH ALUMINA OR ZIRCONIA
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
07/20/1999
|
Application #:
|
08887064
|
Filing Dt:
|
07/02/1997
|
|
Title:
|
METHOD FOR CONTROLLING SOLDER BUMP SHAPE AND STAND-OFF HEIGHT
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
02/09/1999
|
Application #:
|
08954266
|
Filing Dt:
|
10/20/1997
|
|
Title:
|
METHOD OF MAKING A THICK FILM PRESSURE SENSOR
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
07/27/1999
|
Application #:
|
08954385
|
Filing Dt:
|
10/20/1997
|
|
Title:
|
THICK FILM CIRCUIT HAVING IMPROVED CONDUCTOR COMPOSITON WITH COATED METALLIC PARTICLES
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
10/05/1999
|
Application #:
|
08985436
|
Filing Dt:
|
12/05/1997
|
|
Title:
|
METHOD FOR CONTROLLING SOLDERABILITY OF A CONDUCTOR AND CONDUCTOR FORMED THEREBY
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
06/08/1999
|
Application #:
|
08991685
|
Filing Dt:
|
12/16/1997
|
|
Title:
|
METHOD OF MANUFACTURE FOR A THICK FILM MULTI-LAYER CIRCUIT
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
04/27/1999
|
Application #:
|
08994113
|
Filing Dt:
|
12/19/1997
|
|
Title:
|
DIFFUSION-BARRIER MATERIALS FOR THICK-FILM PIEZORESISTORS AND SENSORS FORMED THEREWITH
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
09/28/1999
|
Application #:
|
08995801
|
Filing Dt:
|
12/22/1997
|
|
Title:
|
STRAIN GAUGE WITH STEEL SUBSTRATE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
02/08/2000
|
Application #:
|
09127291
|
Filing Dt:
|
07/31/1998
|
|
Title:
|
METAL DIAPHRAGM SENSOR WITH POLYSILICON SENSING ELEMENTS AND METHODS THEREFOR
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
01/30/2001
|
Application #:
|
09178758
|
Filing Dt:
|
10/26/1998
|
|
Title:
|
METHOD OF FORMING RUTHENIUM-BASED THICK-FILM RESISTORS
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
05/22/2001
|
Application #:
|
09232951
|
Filing Dt:
|
01/17/1999
|
|
Title:
|
METHOD OF FORMING THICK-FILM HYBRID CIRCUIT ON A METAL CIRCUIT BOARD
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
11/21/2000
|
Application #:
|
09344046
|
Filing Dt:
|
06/25/1999
|
|
Title:
|
THICK-FILM CIRCUITS AND METALLIZATION PROCESS
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
12/26/2000
|
Application #:
|
09384892
|
Filing Dt:
|
08/27/1999
|
|
Title:
|
METHOD OF MANUFACTURING A THICK FILM CIRCUIT WITH CONSTRAINED ADHESIVE SPREADING
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
04/24/2001
|
Application #:
|
09385051
|
Filing Dt:
|
08/30/1999
|
|
Title:
|
HIGH CURRENT CIRCUIT TRACE AND COMPOSITION AND METHOD THEREFOR
|
|
