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Reel/Frame:037581/0466   Pages: 21
Recorded: 01/25/2016
Attorney Dkt #:PANNOVA-TATA-ASSIGN
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 50
1
Patent #:
Issue Dt:
06/30/1998
Application #:
08802025
Filing Dt:
02/18/1997
Title:
SEMICONDUCTOR DEVICE HAVING OFFSETCHIPS
2
Patent #:
Issue Dt:
08/24/1999
Application #:
08955441
Filing Dt:
10/21/1997
Title:
PLASTIC ENCAPSULATED SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
3
Patent #:
Issue Dt:
07/27/1999
Application #:
09040304
Filing Dt:
03/18/1998
Title:
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
4
Patent #:
Issue Dt:
02/11/2003
Application #:
09174536
Filing Dt:
10/19/1998
Title:
PROBE CARD
5
Patent #:
Issue Dt:
10/10/2000
Application #:
09332970
Filing Dt:
06/15/1999
Title:
PLASTIC ENCAPSULATED SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
6
Patent #:
Issue Dt:
05/31/2005
Application #:
09380312
Filing Dt:
08/31/1999
Title:
RESIN MOLDED TYPE SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME
7
Patent #:
Issue Dt:
03/27/2001
Application #:
09432216
Filing Dt:
11/03/1999
Title:
LEADFRAME FOR USE IN MANUFACTURING A RESIN-MOLDED SEMICONDUCTOR DEVICE
8
Patent #:
Issue Dt:
12/31/2002
Application #:
09657484
Filing Dt:
09/08/2000
Title:
LEASD FRAM WHICH INCLUDES A DIE PAD, A SUPPORT LEAD, AND INNER LEADS
9
Patent #:
Issue Dt:
08/13/2002
Application #:
09735792
Filing Dt:
12/14/2000
Publication #:
Pub Dt:
10/04/2001
Title:
PRINTED WIRING BOARD, IC CARD MODULE USING THE SAME, AND METHOD FOR PRODUCING IC CARD MODULE
10
Patent #:
Issue Dt:
01/15/2002
Application #:
09771548
Filing Dt:
01/30/2001
Publication #:
Pub Dt:
07/12/2001
Title:
Resin-molded semicondutor device, method for manufacturing the same, and leadframe
11
Patent #:
Issue Dt:
08/05/2003
Application #:
09879082
Filing Dt:
06/13/2001
Publication #:
Pub Dt:
08/15/2002
Title:
LEAD FRAME AND METHOD FOR FABRICATING RESIN-ENCAPSULATED SEMICONDUCTOR DEVICE USING THE SAME
12
Patent #:
Issue Dt:
01/21/2003
Application #:
09946363
Filing Dt:
09/06/2001
Publication #:
Pub Dt:
03/07/2002
Title:
SEMICONDUCTOR DEVICE HAVING A PLURALITY OF STACKED SEMICONDUCTOR CHIPS ON A WIRING BOARD
13
Patent #:
Issue Dt:
01/28/2003
Application #:
09984191
Filing Dt:
10/29/2001
Publication #:
Pub Dt:
05/30/2002
Title:
SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING THE SAME
14
Patent #:
Issue Dt:
02/08/2005
Application #:
10165279
Filing Dt:
06/10/2002
Publication #:
Pub Dt:
10/17/2002
Title:
SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING THE SAME
15
Patent #:
Issue Dt:
01/13/2004
Application #:
10170136
Filing Dt:
06/12/2002
Publication #:
Pub Dt:
12/19/2002
Title:
SEMICONDUCTOR PACKAGE HAVING TWO CHIPS INTERNALLY CONNECTED TOGETHER WITH BUMP ELECTRODES AND BOTH CHIPS EXTERNALLY CONNECTED TO LEAD FRAME WITH BOND WIRES
16
Patent #:
Issue Dt:
06/05/2012
Application #:
10173900
Filing Dt:
06/19/2002
Publication #:
Pub Dt:
07/10/2003
Title:
RESIN ENCAPSULATED SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
17
Patent #:
Issue Dt:
06/21/2005
Application #:
10199109
Filing Dt:
07/22/2002
Publication #:
Pub Dt:
01/23/2003
Title:
RESIN ENCAPSULATION SEMICONDUCTOR DEVICE UTILIZING GROOVED LEADS AND DIE PAD
18
Patent #:
Issue Dt:
08/31/2004
Application #:
10307450
Filing Dt:
12/02/2002
Publication #:
Pub Dt:
06/26/2003
Title:
SEMICONDUCTOR DEVICE INCLUDING A DIFFUSION LAYER FORMED BETWEEN ELECTRODE PORTIONS
19
Patent #:
Issue Dt:
08/17/2004
Application #:
10320362
Filing Dt:
12/17/2002
Publication #:
Pub Dt:
05/08/2003
Title:
SEMICONDUCTOR DEVICE
20
Patent #:
Issue Dt:
03/16/2004
Application #:
10320379
Filing Dt:
12/17/2002
Publication #:
Pub Dt:
05/08/2003
Title:
STACKED SEMICONDUCTOR CHIPS ATTACHED TO A WIRING BOARD
21
Patent #:
Issue Dt:
02/17/2004
Application #:
10320405
Filing Dt:
12/17/2002
Publication #:
Pub Dt:
05/15/2003
Title:
SEMICONDUCTOR DEVICE
22
Patent #:
Issue Dt:
12/28/2004
Application #:
10438847
Filing Dt:
05/16/2003
Publication #:
Pub Dt:
10/30/2003
Title:
LEAD FRAME AND METHOD FOR FABRICATING RESIN-ENCAPSULATED SEMICONDUCTOR DEVICE USING THE SAME
23
Patent #:
Issue Dt:
03/20/2007
Application #:
10607274
Filing Dt:
06/27/2003
Publication #:
Pub Dt:
02/26/2004
Title:
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
24
Patent #:
Issue Dt:
11/21/2006
Application #:
10608295
Filing Dt:
06/24/2003
Publication #:
Pub Dt:
03/18/2004
Title:
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
25
Patent #:
Issue Dt:
01/31/2006
Application #:
10649741
Filing Dt:
08/28/2003
Publication #:
Pub Dt:
07/01/2004
Title:
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
26
Patent #:
Issue Dt:
05/09/2006
Application #:
10689642
Filing Dt:
10/22/2003
Publication #:
Pub Dt:
04/29/2004
Title:
LEADFRAME, PLASTIC-ENCAPSULATED SEMICONDUCTOR DEVICE, AND METHOD FOR FABRICATING THE SAME
27
Patent #:
Issue Dt:
03/01/2005
Application #:
10747982
Filing Dt:
12/31/2003
Publication #:
Pub Dt:
08/05/2004
Title:
RESIN MOLDED TYPE SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME
28
Patent #:
Issue Dt:
10/18/2005
Application #:
10756121
Filing Dt:
01/12/2004
Publication #:
Pub Dt:
07/29/2004
Title:
SEMICONDUCTOR DEVICE WITH FOLDED FILM SUBSTRATE AND DISPLAY DEVICE USING THE SAME
29
Patent #:
Issue Dt:
07/18/2006
Application #:
10766892
Filing Dt:
01/30/2004
Publication #:
Pub Dt:
09/23/2004
Title:
SEMICONDUCTOR DEVICE
30
Patent #:
Issue Dt:
04/17/2007
Application #:
10875624
Filing Dt:
06/25/2004
Publication #:
Pub Dt:
01/27/2005
Title:
SEMICONDUCTOR INTEGRATED CIRCUIT, AND ELECTROSTATIC WITHSTAND VOLTAGE TEST METHOD AND APPARATUS THEREFOR
31
Patent #:
Issue Dt:
07/03/2007
Application #:
10881044
Filing Dt:
06/30/2004
Publication #:
Pub Dt:
01/06/2005
Title:
STACKED CHIP SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
32
Patent #:
Issue Dt:
10/11/2005
Application #:
10919402
Filing Dt:
08/17/2004
Publication #:
Pub Dt:
01/20/2005
Title:
SEMICONDUCTOR DEVICE INCLUDING A DIFFUSION LAYER
33
Patent #:
Issue Dt:
05/26/2009
Application #:
10991864
Filing Dt:
11/19/2004
Publication #:
Pub Dt:
04/28/2005
Title:
RESIN MOLDED TYPE SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME
34
Patent #:
Issue Dt:
10/24/2006
Application #:
11018541
Filing Dt:
12/21/2004
Publication #:
Pub Dt:
05/26/2005
Title:
LEAD FRAME, RESIN-ENCAPSULATED SEMICONDUCTOR DEVICE, AND METHOD OF PRODUCING THE SAME
35
Patent #:
Issue Dt:
09/29/2009
Application #:
11057195
Filing Dt:
02/15/2005
Publication #:
Pub Dt:
07/07/2005
Title:
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
36
Patent #:
Issue Dt:
03/04/2008
Application #:
11090011
Filing Dt:
03/28/2005
Publication #:
Pub Dt:
08/04/2005
Title:
RESIN-ENCAPSULATION SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
37
Patent #:
Issue Dt:
11/07/2006
Application #:
11154541
Filing Dt:
06/17/2005
Publication #:
Pub Dt:
10/27/2005
Title:
LEADFRAME, PLASTIC-ENCAPSULATED SEMICONDUCTOR DEVICE, AND METHOD FOR FABRICATING THE SAME
38
Patent #:
Issue Dt:
04/21/2009
Application #:
11717953
Filing Dt:
03/14/2007
Publication #:
Pub Dt:
08/16/2007
Title:
STACKED CHIP SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
39
Patent #:
Issue Dt:
06/01/2010
Application #:
11826673
Filing Dt:
07/17/2007
Publication #:
Pub Dt:
04/17/2008
Title:
SEMICONDUCTOR DEVICE HAVING RECESSED CONNECTOR PORTIONS
40
Patent #:
Issue Dt:
12/14/2010
Application #:
11950625
Filing Dt:
12/05/2007
Publication #:
Pub Dt:
06/12/2008
Title:
SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING THE SAME, AND SEMICONDUCTOR DEVICE MOUNTING STRUCTURE
41
Patent #:
Issue Dt:
10/18/2011
Application #:
12189952
Filing Dt:
08/12/2008
Publication #:
Pub Dt:
02/19/2009
Title:
LEAD FRAME, SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING THE LEAD FRAME, AND METHOD OF MANUFACTURING THE SEMICONDUCTOR DEVICE
42
Patent #:
Issue Dt:
05/31/2011
Application #:
12208804
Filing Dt:
09/11/2008
Publication #:
Pub Dt:
01/08/2009
Title:
RESIN-SEALED SEMICONDUCTOR DEVICE, LEADFRAME WITH DIE PADS, AND MANUFACTURING METHOD FOR LEADFRAME WITH DIE PADS
43
Patent #:
Issue Dt:
06/14/2011
Application #:
12246021
Filing Dt:
10/06/2008
Publication #:
Pub Dt:
04/23/2009
Title:
CARRIER FRAME FOR ELECTRONIC COMPONENTS AND PRODUCTION METHOD FOR ELECTRONIC COMPONENTS
44
Patent #:
Issue Dt:
01/17/2012
Application #:
12372130
Filing Dt:
02/17/2009
Publication #:
Pub Dt:
11/12/2009
Title:
SEMICONDUCTOR DEVICE
45
Patent #:
Issue Dt:
11/09/2010
Application #:
12425682
Filing Dt:
04/17/2009
Publication #:
Pub Dt:
11/12/2009
Title:
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATION
46
Patent #:
Issue Dt:
12/11/2012
Application #:
12721067
Filing Dt:
03/10/2010
Publication #:
Pub Dt:
09/16/2010
Title:
SEMICONDUCTOR DEVICE
47
Patent #:
Issue Dt:
12/06/2011
Application #:
12890058
Filing Dt:
09/24/2010
Publication #:
Pub Dt:
01/20/2011
Title:
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATION
48
Patent #:
Issue Dt:
09/18/2012
Application #:
13008579
Filing Dt:
01/18/2011
Publication #:
Pub Dt:
05/19/2011
Title:
MULTILAYER SEMICONDUCTOR DEVICE AND ELECTRONIC EQUIPMENT
49
Patent #:
Issue Dt:
10/09/2012
Application #:
13049307
Filing Dt:
03/16/2011
Publication #:
Pub Dt:
07/07/2011
Title:
WIRING BOARD, SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
50
Patent #:
Issue Dt:
12/09/2014
Application #:
13308038
Filing Dt:
11/30/2011
Publication #:
Pub Dt:
03/29/2012
Title:
SEMICONDUCTOR DEVICE
Assignor
1
Exec Dt:
01/13/2016
Assignee
1
3025 ORCHARD PARKWAY
SAN JOSE, CALIFORNIA 95134
Correspondence name and address
TESSERA ADVANCED TECHNOLOGIES, INC.
3025 ORCHARD PARKWAY
ATTN: PATENT DEPT.
SAN JOSE, CA 95134

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