Total properties:
50
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Patent #:
|
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Issue Dt:
|
06/30/1998
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Application #:
|
08802025
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Filing Dt:
|
02/18/1997
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Title:
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SEMICONDUCTOR DEVICE HAVING OFFSETCHIPS
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Patent #:
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Issue Dt:
|
08/24/1999
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Application #:
|
08955441
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Filing Dt:
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10/21/1997
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Title:
|
PLASTIC ENCAPSULATED SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
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Patent #:
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Issue Dt:
|
07/27/1999
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Application #:
|
09040304
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Filing Dt:
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03/18/1998
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Title:
|
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
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Patent #:
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Issue Dt:
|
02/11/2003
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Application #:
|
09174536
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Filing Dt:
|
10/19/1998
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Title:
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PROBE CARD
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Patent #:
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Issue Dt:
|
10/10/2000
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Application #:
|
09332970
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Filing Dt:
|
06/15/1999
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Title:
|
PLASTIC ENCAPSULATED SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
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Patent #:
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|
Issue Dt:
|
05/31/2005
|
Application #:
|
09380312
|
Filing Dt:
|
08/31/1999
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Title:
|
RESIN MOLDED TYPE SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME
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Patent #:
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|
Issue Dt:
|
03/27/2001
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Application #:
|
09432216
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Filing Dt:
|
11/03/1999
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Title:
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LEADFRAME FOR USE IN MANUFACTURING A RESIN-MOLDED SEMICONDUCTOR DEVICE
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Patent #:
|
|
Issue Dt:
|
12/31/2002
|
Application #:
|
09657484
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Filing Dt:
|
09/08/2000
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Title:
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LEASD FRAM WHICH INCLUDES A DIE PAD, A SUPPORT LEAD, AND INNER LEADS
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Patent #:
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Issue Dt:
|
08/13/2002
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Application #:
|
09735792
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Filing Dt:
|
12/14/2000
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Publication #:
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Pub Dt:
|
10/04/2001
| | | | |
Title:
|
PRINTED WIRING BOARD, IC CARD MODULE USING THE SAME, AND METHOD FOR PRODUCING IC CARD MODULE
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Patent #:
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Issue Dt:
|
01/15/2002
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Application #:
|
09771548
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Filing Dt:
|
01/30/2001
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Publication #:
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|
Pub Dt:
|
07/12/2001
| | | | |
Title:
|
Resin-molded semicondutor device, method for manufacturing the same, and leadframe
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Patent #:
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Issue Dt:
|
08/05/2003
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Application #:
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09879082
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Filing Dt:
|
06/13/2001
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Publication #:
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Pub Dt:
|
08/15/2002
| | | | |
Title:
|
LEAD FRAME AND METHOD FOR FABRICATING RESIN-ENCAPSULATED SEMICONDUCTOR DEVICE USING THE SAME
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Patent #:
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|
Issue Dt:
|
01/21/2003
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Application #:
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09946363
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Filing Dt:
|
09/06/2001
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Publication #:
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Pub Dt:
|
03/07/2002
| | | | |
Title:
|
SEMICONDUCTOR DEVICE HAVING A PLURALITY OF STACKED SEMICONDUCTOR CHIPS ON A WIRING BOARD
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Patent #:
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Issue Dt:
|
01/28/2003
|
Application #:
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09984191
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Filing Dt:
|
10/29/2001
|
Publication #:
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|
Pub Dt:
|
05/30/2002
| | | | |
Title:
|
SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING THE SAME
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|
Patent #:
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|
Issue Dt:
|
02/08/2005
|
Application #:
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10165279
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Filing Dt:
|
06/10/2002
|
Publication #:
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Pub Dt:
|
10/17/2002
| | | | |
Title:
|
SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING THE SAME
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|
Patent #:
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|
Issue Dt:
|
01/13/2004
|
Application #:
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10170136
|
Filing Dt:
|
06/12/2002
|
Publication #:
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|
Pub Dt:
|
12/19/2002
| | | | |
Title:
|
SEMICONDUCTOR PACKAGE HAVING TWO CHIPS INTERNALLY CONNECTED TOGETHER WITH BUMP ELECTRODES AND BOTH CHIPS EXTERNALLY CONNECTED TO LEAD FRAME WITH BOND WIRES
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Patent #:
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|
Issue Dt:
|
06/05/2012
|
Application #:
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10173900
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Filing Dt:
|
06/19/2002
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Publication #:
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|
Pub Dt:
|
07/10/2003
| | | | |
Title:
|
RESIN ENCAPSULATED SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
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|
Patent #:
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Issue Dt:
|
06/21/2005
|
Application #:
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10199109
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Filing Dt:
|
07/22/2002
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Publication #:
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|
Pub Dt:
|
01/23/2003
| | | | |
Title:
|
RESIN ENCAPSULATION SEMICONDUCTOR DEVICE UTILIZING GROOVED LEADS AND DIE PAD
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Patent #:
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Issue Dt:
|
08/31/2004
|
Application #:
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10307450
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Filing Dt:
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12/02/2002
|
Publication #:
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Pub Dt:
|
06/26/2003
| | | | |
Title:
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SEMICONDUCTOR DEVICE INCLUDING A DIFFUSION LAYER FORMED BETWEEN ELECTRODE PORTIONS
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Patent #:
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Issue Dt:
|
08/17/2004
|
Application #:
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10320362
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Filing Dt:
|
12/17/2002
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Publication #:
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Pub Dt:
|
05/08/2003
| | | | |
Title:
|
SEMICONDUCTOR DEVICE
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Patent #:
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|
Issue Dt:
|
03/16/2004
|
Application #:
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10320379
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Filing Dt:
|
12/17/2002
|
Publication #:
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|
Pub Dt:
|
05/08/2003
| | | | |
Title:
|
STACKED SEMICONDUCTOR CHIPS ATTACHED TO A WIRING BOARD
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|
Patent #:
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Issue Dt:
|
02/17/2004
|
Application #:
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10320405
|
Filing Dt:
|
12/17/2002
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Publication #:
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Pub Dt:
|
05/15/2003
| | | | |
Title:
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SEMICONDUCTOR DEVICE
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Patent #:
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Issue Dt:
|
12/28/2004
|
Application #:
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10438847
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Filing Dt:
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05/16/2003
|
Publication #:
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|
Pub Dt:
|
10/30/2003
| | | | |
Title:
|
LEAD FRAME AND METHOD FOR FABRICATING RESIN-ENCAPSULATED SEMICONDUCTOR DEVICE USING THE SAME
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Patent #:
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|
Issue Dt:
|
03/20/2007
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Application #:
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10607274
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Filing Dt:
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06/27/2003
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Publication #:
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Pub Dt:
|
02/26/2004
| | | | |
Title:
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SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
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Patent #:
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Issue Dt:
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11/21/2006
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Application #:
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10608295
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Filing Dt:
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06/24/2003
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Publication #:
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Pub Dt:
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03/18/2004
| | | | |
Title:
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SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
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Patent #:
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Issue Dt:
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01/31/2006
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Application #:
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10649741
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Filing Dt:
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08/28/2003
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Publication #:
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Pub Dt:
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07/01/2004
| | | | |
Title:
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SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
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Patent #:
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|
Issue Dt:
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05/09/2006
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Application #:
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10689642
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Filing Dt:
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10/22/2003
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Publication #:
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Pub Dt:
|
04/29/2004
| | | | |
Title:
|
LEADFRAME, PLASTIC-ENCAPSULATED SEMICONDUCTOR DEVICE, AND METHOD FOR FABRICATING THE SAME
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Patent #:
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Issue Dt:
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03/01/2005
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Application #:
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10747982
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Filing Dt:
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12/31/2003
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Publication #:
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Pub Dt:
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08/05/2004
| | | | |
Title:
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RESIN MOLDED TYPE SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME
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Patent #:
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Issue Dt:
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10/18/2005
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Application #:
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10756121
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Filing Dt:
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01/12/2004
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Publication #:
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Pub Dt:
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07/29/2004
| | | | |
Title:
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SEMICONDUCTOR DEVICE WITH FOLDED FILM SUBSTRATE AND DISPLAY DEVICE USING THE SAME
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Patent #:
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Issue Dt:
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07/18/2006
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Application #:
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10766892
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Filing Dt:
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01/30/2004
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Publication #:
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Pub Dt:
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09/23/2004
| | | | |
Title:
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SEMICONDUCTOR DEVICE
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Patent #:
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Issue Dt:
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04/17/2007
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Application #:
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10875624
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Filing Dt:
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06/25/2004
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Publication #:
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Pub Dt:
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01/27/2005
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Title:
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SEMICONDUCTOR INTEGRATED CIRCUIT, AND ELECTROSTATIC WITHSTAND VOLTAGE TEST METHOD AND APPARATUS THEREFOR
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Patent #:
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Issue Dt:
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07/03/2007
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Application #:
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10881044
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Filing Dt:
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06/30/2004
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Publication #:
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Pub Dt:
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01/06/2005
| | | | |
Title:
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STACKED CHIP SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
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Patent #:
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Issue Dt:
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10/11/2005
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Application #:
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10919402
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Filing Dt:
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08/17/2004
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Publication #:
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Pub Dt:
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01/20/2005
| | | | |
Title:
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SEMICONDUCTOR DEVICE INCLUDING A DIFFUSION LAYER
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Patent #:
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Issue Dt:
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05/26/2009
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Application #:
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10991864
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Filing Dt:
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11/19/2004
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Publication #:
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Pub Dt:
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04/28/2005
| | | | |
Title:
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RESIN MOLDED TYPE SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME
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Patent #:
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Issue Dt:
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10/24/2006
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Application #:
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11018541
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12/21/2004
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Publication #:
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Pub Dt:
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05/26/2005
| | | | |
Title:
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LEAD FRAME, RESIN-ENCAPSULATED SEMICONDUCTOR DEVICE, AND METHOD OF PRODUCING THE SAME
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Patent #:
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09/29/2009
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11057195
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02/15/2005
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07/07/2005
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Title:
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SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
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03/04/2008
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11090011
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03/28/2005
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Pub Dt:
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08/04/2005
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Title:
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RESIN-ENCAPSULATION SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
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Patent #:
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11/07/2006
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11154541
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06/17/2005
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Pub Dt:
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10/27/2005
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Title:
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LEADFRAME, PLASTIC-ENCAPSULATED SEMICONDUCTOR DEVICE, AND METHOD FOR FABRICATING THE SAME
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04/21/2009
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11717953
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03/14/2007
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Pub Dt:
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08/16/2007
| | | | |
Title:
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STACKED CHIP SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
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Patent #:
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06/01/2010
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11826673
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07/17/2007
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Publication #:
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Pub Dt:
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04/17/2008
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Title:
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SEMICONDUCTOR DEVICE HAVING RECESSED CONNECTOR PORTIONS
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Patent #:
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Issue Dt:
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12/14/2010
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11950625
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12/05/2007
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Publication #:
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Pub Dt:
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06/12/2008
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Title:
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SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING THE SAME, AND SEMICONDUCTOR DEVICE MOUNTING STRUCTURE
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Issue Dt:
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10/18/2011
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Application #:
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12189952
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08/12/2008
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Publication #:
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Pub Dt:
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02/19/2009
| | | | |
Title:
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LEAD FRAME, SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING THE LEAD FRAME, AND METHOD OF MANUFACTURING THE SEMICONDUCTOR DEVICE
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Issue Dt:
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05/31/2011
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Application #:
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12208804
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09/11/2008
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Publication #:
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Pub Dt:
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01/08/2009
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Title:
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RESIN-SEALED SEMICONDUCTOR DEVICE, LEADFRAME WITH DIE PADS, AND MANUFACTURING METHOD FOR LEADFRAME WITH DIE PADS
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Patent #:
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Issue Dt:
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06/14/2011
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12246021
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10/06/2008
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Publication #:
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Pub Dt:
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04/23/2009
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Title:
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CARRIER FRAME FOR ELECTRONIC COMPONENTS AND PRODUCTION METHOD FOR ELECTRONIC COMPONENTS
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Issue Dt:
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01/17/2012
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12372130
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02/17/2009
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Pub Dt:
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11/12/2009
| | | | |
Title:
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SEMICONDUCTOR DEVICE
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Patent #:
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Issue Dt:
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11/09/2010
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Application #:
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12425682
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Filing Dt:
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04/17/2009
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Publication #:
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Pub Dt:
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11/12/2009
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Title:
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SEMICONDUCTOR DEVICE AND METHOD OF FABRICATION
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Patent #:
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Issue Dt:
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12/11/2012
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Application #:
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12721067
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03/10/2010
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Pub Dt:
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09/16/2010
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Title:
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SEMICONDUCTOR DEVICE
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Patent #:
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Issue Dt:
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12/06/2011
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Application #:
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12890058
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09/24/2010
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Publication #:
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Pub Dt:
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01/20/2011
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Title:
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SEMICONDUCTOR DEVICE AND METHOD OF FABRICATION
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Patent #:
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09/18/2012
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13008579
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01/18/2011
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Publication #:
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Pub Dt:
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05/19/2011
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Title:
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MULTILAYER SEMICONDUCTOR DEVICE AND ELECTRONIC EQUIPMENT
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Issue Dt:
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10/09/2012
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13049307
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03/16/2011
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Publication #:
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Pub Dt:
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07/07/2011
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Title:
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WIRING BOARD, SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
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Patent #:
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Issue Dt:
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12/09/2014
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Application #:
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13308038
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11/30/2011
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Publication #:
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Pub Dt:
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03/29/2012
| | | | |
Title:
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SEMICONDUCTOR DEVICE
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