Patent Assignment Details
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| Reel/Frame: | 037688/0327 | |
| Pages: | 4 |
| | Recorded: | 02/08/2016 | | |
| Attorney Dkt #: | ALPSP521 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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03/27/2018
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Application #:
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15018756
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Filing Dt:
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02/08/2016
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Publication #:
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Pub Dt:
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09/15/2016
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Title:
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CONNECTION STRUCTURE OF WIRING SUBSTRATE, AND CONNECTION METHOD OF WIRING SUBSTRATE
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Assignee
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| 1-7 YUKIGAYA-OTSUKAMACHI, OTA-KU |
| TOKYO, JAPAN |
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Correspondence name and address
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BEYER LAW GROUP LLP
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P.O BOX 51887
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PALO ALTO, CA 94303
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