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Reel/Frame:037710/0542   Pages: 6
Recorded: 02/11/2016
Attorney Dkt #:YOR920120697US4
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
05/09/2017
Application #:
15041213
Filing Dt:
02/11/2016
Publication #:
Pub Dt:
06/09/2016
Title:
CHIP STACK STRUCTURES THAT IMPLEMENT TWO-PHASE COOLING WITH RADIAL FLOW
Assignors
1
Exec Dt:
11/26/2013
2
Exec Dt:
09/10/2013
3
Exec Dt:
09/10/2013
4
Exec Dt:
11/26/2013
5
Exec Dt:
11/26/2013
6
Exec Dt:
09/10/2013
Assignee
1
NEW ORCHARD ROAD
ARMONK, NEW YORK 10504
Correspondence name and address
FRANK V. DEROSA
48 SOUTH SERVICE ROAD, SUITE 100
RYAN, MASON & LEWIS, LLP
MELVILLE, NY 11747

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