Patent Assignment Details
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Reel/Frame: | 037881/0812 | |
| Pages: | 5 |
| | Recorded: | 02/23/2016 | | |
Attorney Dkt #: | 52433/1144 |
Conveyance: | CORRECTIVE ASSIGNMENT TO CORRECT THE RECEVING PARTY CITY FIELD FROM TOKYO TO OSAKA. PREVIOUSLY RECORDED ON REEL 037769 FRAME 0919. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. |
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Total properties:
1
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Patent #:
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Issue Dt:
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05/16/2006
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Application #:
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09632910
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Filing Dt:
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08/04/2000
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Title:
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METHOD FOR FABRICATING A SEMICONDUCTOR DEVICES PROVIDED WITH LOW MELTING POINT METAL BUMPS
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Assignee
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2-5-5, SHIMODERA |
NANIWA-KU, OSAKA-SHI |
OSAKA, JAPAN |
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Correspondence name and address
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PATRICK J BIRDE
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1 BROADWAY
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KENYON & KENYON LLP
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NEW YORK, NY 10004
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