Patent Assignment Details
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| Reel/Frame: | 037890/0478 | |
| Pages: | 12 |
| | Recorded: | 03/04/2016 | | |
| Attorney Dkt #: | TSMCP395USA |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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01/31/2017
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Application #:
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15060807
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Filing Dt:
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03/04/2016
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Publication #:
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Pub Dt:
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06/30/2016
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Title:
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WAFER BACK-SIDE POLISHING SYSTEM AND METHOD FOR INTEGRATED CIRCUIT DEVICE MANUFACTURING PROCESSES
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Assignee
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| NO. 8, LI-HSIN RD. 6 |
| HSIN-CHU SCIENCE PARK |
| HSIN-CHU, TAIWAN 300-77 |
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Correspondence name and address
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ESCHWEILER & ASSOCIATES
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629 EUCLID AVE.
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SUITE 1000
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CLEVELAND, OH 44114
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